LED Driver Demonstrates Low Dropout

February 11, 2009 4:15 am | Product Releases | Comments

Serving LED indicators and LCD or keyboard backlighting in entry-level mobile products, AnalogicTech’s AHK3292 2-channel LED driver (SSLD) has a typical dropout voltage of 36 mV. Operating off an input supply from 2.7 V to 5.5 V, the component drives up to 2 LEDs. The SSLD exhibits a maximum LED current of 30.2 mA with ±10% LED output current accuracy and ±3% LED output current matching. An

LISTED UNDER: ICs | Optoelectronics & Displays

Power Management IC Offers High Configurability

February 10, 2009 4:44 am | Product Releases | Comments

Conceived as a platform device, the DA9052 power management IC from Dialog is capable of supporting all major families of application and mobile graphics processors. Up to 14 power supplies, 16 GPIOs, and other system functions in different operating modes help reduce significantly power consumption overhead in the host processor.


LED Driver Manages SuperCapacitor-Based Photoflash

February 9, 2009 4:55 am | On Semiconductor | Product Releases | Comments

Addressing the expanding need for high-intensity LED flash capability, the CAT3224 Solid-State Lighting Driver (SSLD) is capable of sourcing up to 4 A for photoflash and up to 400 mA of torch-mode current as well as the charging function for dual-cell supercapacitors. Functions such as charging, flash, and torch are activated via a parallel logic interface, with the operating current of each mode programmed by three external resistors.

LISTED UNDER: ICs | Optoelectronics & Displays

Communications Processor Drives Networking Equipment

February 9, 2009 4:23 am | Product Releases | Comments

Based on 45-nm silicon-on-insulator (SOI) technology, Freescale Semiconductor's MPC8569E PowerQUICC III communications processor enables the creation of advanced wireless and wireline networking equipment. The device offloads data path tasks to the QUICC Engine block, which handles termination, interworking, and switching between a range of communication protocols and interface standards, including Gigabit Ethernet, ATM,


Doherty Amplifiers Offer Efficiency >40%

February 6, 2009 6:10 am | Product Releases | Comments

The BLD6G21-50 and BLD6G22-50 Doherty amplifiers from NXP Semiconductors offers efficiency of greater than 40 percent at an average power of 10 W. This enables 35% lower power dissipation under multi-carrier signal operation compared to class AB amplifiers. The BLD6G21-50 is designed for TD-SCDMA operation at frequencies from 2010 MHz to 2025 MHz, whereas the BLD6G22-50 operates at frequencies


FPGA Families Enable Improved Designs

February 6, 2009 4:29 am | Product Releases | Comments

Providing system designers with improved methodologies for creating FPGA-based system-on-chip solutions, the Virtex-6 and Spartan-6 FPGA families from Xilinx can deliver twice the capacity at half the power consumption compared to previous families. With a logic density of up to 760 K and more than 38 Mbit of BlockRAM and 2,000 DSP slices, these new Xilinx devices set new benchmarks in on-chip performance.

LISTED UNDER: Boards & Modules | ICs

Dual-Core SoC Has Onboard Image Recognition

February 4, 2009 5:13 am | Renesas | Product Releases | Comments

Integrating two SH-4A 32-bit CPU cores on a single chip, the SH7776 (SH-Navi3) system-on-chip (SoC) from Renesas also incorporates on-chip graphics functions and image-recognition processing as well as a 2-D and 3-D graphics processor for improved map rendering and operation screens. Suitable for applications such as next-generation high-performance car information terminals, the device performs at 1,920 MIPS at 533 MHz and can execute multiple external environment recognition programs

LISTED UNDER: Boards & Modules | ICs

Current-to-Digital Converter Enables Image Capturing in CT Systems

February 4, 2009 4:36 am | Analog Devices, Inc. | Product Releases | Comments

Offering 128 data conversion channels, Analog Devices’ ADAS1128 24-bit current-to-digital converter allows high-slice-count CT systems to capture real-time moving images, such as a beating heart. The 10-mm × 10-mm mini BGA-packaged unit exhibits sample rates of up to 20 ksps (50-µs integration time), simultaneous sampling, noise down to 0.4 fC, and power dissipation of 4.5 mW/channel at full speed. All converted


Microwave Transistors Serve Telecom Applications

February 3, 2009 4:57 am | Product Releases | Comments

Coming in industry-standard ceramic-metal packages, Cree's CGH21120F and CGH25120F GaN HEMT microwave transistors perform in telecommunication applications, such as W-CDMA, LTE and WiMAX. The components consist of single, input-pre-matched GaN HEMT devices providing >120 W. The CGH21120F is designed for


Equaliser/Driver/Retimer IC Addresses 10G SFP+ System Design

February 3, 2009 4:01 am | Product Releases | Comments

Suitable for ‘direct attach’ passive twin-ax copper cables and 10GBASE-SR optical modules, Phyworks’ PHY1066 equaliser, driver, and retimer IC enables host board designers to create 10-Gbps Ethernet SFP+ receive and transmit interfaces. The flip-chip, 36-pin, BGA-packaged component dissipates 0.68 W and drives up to 15 m of ‘direct attach’ passive SFP+ copper cable. The device’s hardware algorithms are said to


Amp Family Maintains 1.14 mA/channel Quiescent Current

February 2, 2009 9:54 am | Product Releases | Comments

Intended for applications such as pressure and flow meters, seismic equipment, and electrocardiogram machines, the THS differential amplifier family from Texas Instruments has a quiescent current of 1.14 mA/channel. With a power-down current of 20 µA, the devices have a 145-MHz and 490-V/µs slew rate to buffer and amplify signals. Other features include


Battery Charger IC Enhances Internal Protection

February 2, 2009 4:20 am | Stmicroelectronics | Product Releases | Comments

Operating in cell phone handsets, STMicroelectronics’ ESDA8V-1MX2 battery charger IC absorbs mains-borne surges containing peak pulse energy of up to 500 W. The 1-mm × 1.45-mm × 0.55-mm unit offers a 50% reduction in leakage current, which reduces drain on the battery for improved performance and longer recharge


DRAM Chip Is Densest Available

January 30, 2009 10:50 am | Product Releases | Comments

Using 50-nm process technology, the 4Gb DDR3 DRAM chip from Samsung is presented as having the highest density available. The chip can be produced in 16-GB registered DIMMs for servers, as well as 8-GB unbuffered DIMM, and 8-GB small outline DIMM.


Integrated PoE-PD Controllers Meet IEEE802.3at Standard

January 29, 2009 6:58 am | On Semiconductor | Product Releases | Comments

Supporting communications, industrial, and consumer applications, ON Semiconductor’s NCP1081 and NCP1083 integrated Power-over-Ethernet Powered Device (PoE-PD)/DC/DC converter controllers have been verified to meet the upcoming IEEE802.3at standard. The pin-compatible components provide power levels of up to


Software Tools Aid RF Design

January 29, 2009 5:32 am | Analog Devices, Inc. | Product Releases | Comments

Two downloadable software tools from Analog Devices are intended to aid in RF systems design. The ADIsimRF design tool calculates a variety of parameters within an RF system including cascaded gain, noise figure, and power consumption. ADIsimPLL Version 3.1 development software



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