Heat Pips Thermal Gap Pads Materials and Substrates
New option for thermoelectrically cooled electronic enclosures makes washdowns fast and easy
June 10, 2013 1:26 pm | Product Releases | CommentsEIC Solutions has announced the new M74 clean out modification option which facilitates washdown of thermoelectric coolers mounted to electronic enclosures. The M74 option was application-driven arising from suggestions received from customers in food processing, and other process industries requiring frequent rinsing or washing of equipment.
LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | Metal
Epoxy mount socket operates at bandwidths up to 8 GHz
May 22, 2013 3:12 pm | Ironwood Electronics, Inc. | Product Releases | CommentsIronwood Electronics has recently introduced a new high-performance BGA socket for 0.8mm pitch BGA 78 pin DDR3 packages. The SG-BGA-6374 socket is designed for an 9x13 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss.
LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | Ethernet/Internet
Dispensable thermal pads tout desirable performance for LED lamps, luminaires
April 24, 2013 11:41 am | Product Releases | CommentsDow Corning introduced new Dispensable Thermal Pads, which are positioned as providing cost-effective thermal management in LED lighting applications. The new materials are said to enable LED lamp and luminaire manufacturers t
LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates
Coolers designed for low-profile applications
March 6, 2013 9:52 am | Jaro Thermal | Product Releases | CommentsBy embedding a leading-edge 50x50x13 mm fan inside of a skived-copper-fin heatsink, Jaro's unique "Skive" Cooler significantly reduces height requirements for low-profile applications, while providing unsurpassed surface-area. The dense arrangement of thin copper fins offers unheralded thermal conductivity.
LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates
Low-viscosity thermally conductive silicone compound fills all unwanted gaps up to 0.50mm in height
March 4, 2013 10:55 am | Product Releases | CommentsFujipoly announces the introduction of SARCON® SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to 0.50mm in height.
LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates
Thermal imaging test kits designed for research, development, and machine vision applications
February 21, 2013 3:13 pm | Product Releases | CommentsFLIR Systems introduces its new FLIR A5sc, A15sc, and A35sc longwave infrared thermal imaging camera kits. Designed specifically for thermal bench top testing applications and easy deployment in tight machine vision locations, AX5sc cameras are available in a variety of pixel resolutions from 80×64 and 160×128 up to 320×256....
LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | Temperature
Thermal interface material designed to transfer heat to heat sink
January 29, 2013 4:13 pm | Fujipoly America | Product Releases | CommentsFujipoly announces the availability of Sarcon50GR-Ae, an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink. The unique physical properties of this material allow it to protect delicate board-level components as it fills unwanted air gaps and levels uneven surfaces.
LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates