Potting Compound Protects Heat-Sensitive Parts
September 16, 2009 7:44 am | Product Releases | CommentsContaining no solvents or diluents, Master Bond's EP30M3LV low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations.
LISTED UNDER: Cooling & Thermal Management | Packaging & InterconnectsFan Trays cover Depths from 250-350 mm
September 14, 2009 8:34 am | 3M Electronics Solutions Division | Product Releases | CommentsDesigned to provide localised cooling of 19" rack mounted or desktop equipment, the range of 19” 1U standard fan trays from Verotec consists of two depths--a 250 mm deep unit fitted with three fans and a 350 mm deep unit with six fans. The trays are populated with fans operating from 12 VDC, 24 VDC, or 48 VDC, or 115 VAC or 230 VAC
LISTED UNDER: Cooling & Thermal Management | Electromechanical/Mechanical DevicesThermal Management Software Builds Models Entirely From Intelligent Objects
August 3, 2009 10:43 am | Product Releases | CommentsFuture Facilities has introduced its 6SigmaET electronic cooling software. It is capable of building the model entirely from intelligent objects which speeds up model creation, enables automatic gridding and simplifies post-processing. It supports the
LISTED UNDER: Cooling & Thermal Management | Electromechanical/Mechanical DevicesAdhesive Optimizes Heat Dissipation
August 3, 2009 10:17 am | Product Releases | CommentsFeaturing thermal conductivity and electrical insulation properties, the EP30BN boron nitride epoxy adhesive from Master Bond is designed to optimize heat dissipation of aerospace, defense and microelectronic assemblies. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Temperature range is from -60°F to 300°F ( 50°C to 150°C).
LISTED UNDER: Cooling & Thermal Management | Packaging & InterconnectsTemperature Controller Can Drive up to 20 A
April 6, 2009 1:02 pm | Product Releases | CommentsThe PTC-CH Series Temperature Controller from Wavelength Electronics offers control in a chassis mount package that can be paralleled to drive up to 20-A current. Designed to operate with the PLD-CH Series Laser Diode Drivers, their controls, connections, and status indicators are compatible
LISTED UNDER: Boards & Modules | Cooling & Thermal ManagementAdhesive Serviceable to Over 400°F
March 27, 2009 7:17 am | Product Releases | CommentsPurportedly resistant to impact, thermal shock, vibration, and fatigue cracking, the Supreme 10HT adhesive from Master Bond is serviceable over a temperature range of 4 K to over 400°F. It is resistant to chemicals including water, oil, fuels, and most organic solvents. The adhesive meets NASA low outgassing specifications
LISTED UNDER: Cooling & Thermal Management | Packaging & InterconnectsMicroscale Heat Pump Enables Pinpoint Thermal Management
March 24, 2009 7:34 am | Product Releases | CommentsNextreme Thermal Solutions' OptoCooler HV14 high voltage, low current thin-film thermoelectric cooler (TEC) targeted at laser diode cooling for the telecommunications achieves a 60°C temperature difference between its cold and hot sides. This temperature difference, known as the ?T, reflects the ability of the device to pump heat efficiently. The OptoCooler HV14 is the first module
LISTED UNDER: Cooling & Thermal Management | Packaging & InterconnectsThermal Imager Fits in Pocket
March 9, 2009 6:37 am | Product Releases | CommentsIncorporating features such as Thermal-on-Visible mode for radiometric temperature data to be displayed directly on the visible image, the Mikron MikroSHOT thermal imaging camera from LumaSense Technologies weighs 10.5 oz and can fit in a pocket. The camera incorporates a 2.7” display and uses off-the-shelf batteries. Features include a measuring range from -20°C to 350°C
LISTED UNDER: Cooling & Thermal Management | Optoelectronics & Displays | Test & MeasurementTemperature-Process Controller Boasts High Accuracy
March 4, 2009 8:07 am | Product Releases | CommentsComing in a 1/16 DIN 74-mm case with NEMA4X and IP66 waterproof and dustproof protection, RKC Instrument’s FB100 temperature/process controller touts an accuracy of 0.1%. The device offers selectable sampling times of 50 ms, 100 ms, or 250 ms; a start-up tuning feature calculating optimum PID values; and selectable PID control via autotuning, “advanced autotuning”, or Brilliant II autotuning. A multi-memory area function stores
LISTED UNDER: Cooling & Thermal Management | Test & Measurement