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Thermometer Touts Wide Termperature Range

June 17, 2010 8:07 am | Product Releases | Comments

Control Company’s Traceable Memory Wide-Range Thermometer temperature range covers –328 to 2,498°F and –200 to 1,370°C. Resolution is 0.1 from –200 to 640°C (–328 to 990°F), otherwise 1°; and meter only accuracy is ±1°C. Supplied stainless-steel, triple-purpose, a Type-K thermocouple probe may be used to

LISTED UNDER: Cooling & Thermal Management | Test & Measurement

Epoxy With High Thermal Conductivity Meets NASA Low Outgassing Specs

June 17, 2010 7:18 am | Product Releases | Comments

Master Bond’s Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring exceptional electrical insulation and toughness. It meets NASA low outgassing specifications and has

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects | Packaging & Interconnects

Thermostatic Controller Adds Integrated Temperature Control to Most Thermoelectric Assemblies

February 3, 2010 5:41 am | Product Releases | Comments

Laird Technologies announced its new Q Series Thermostatic Controller for most Thermoelectric Assemblies (TEAs). The Q Series Thermostatic Controller is a microcontroller-based device that adds integrated temperature control to a TEA. The controller functions as a 

LISTED UNDER: Boards & Modules | Cooling & Thermal Management | Electromechanical/Mechanical Devices
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Surface Mount Resistor is Thermally Efficient

January 27, 2010 11:39 am | Product Releases | Comments

The HPC series from Stackpole is a compact surface mount 5 watt resistor. The HPC Series incorporates four parallel thick film chip resistor elements to accommodate the higher power handling and the anodized heat sink allows for increased heat dissipation into the ambient air. These parallel resistance elements allow the HPC Series to withstand up to 2500 watts for pulse durations of 100 microseconds or less.

LISTED UNDER: Cooling & Thermal Management

Spot-Cooling Tech Uses Turbulent Air

December 3, 2009 10:14 am | Product Releases | Comments

JaroThermal announced the introduction of its brand new NtelliJet series of Low-Profile coolers today. The new low-acoustic cooler uses rapid-fire pulses of turbulent air (produced by an oscillating diaphragm working between 50 and 200hz ) to cool heatsinks and surrounding components.

LISTED UNDER: Cooling & Thermal Management

High Temperature USB Data Logger Comes In Stainless Steel Housing

December 3, 2009 8:39 am | Product Releases | Comments

The EL-USB-1-PRO is a high temperature USB data logger capable of measuring and recording over 32,000 temperature readings from -40°F to +257°F/-40°C to +125°C. Housed in a waterproof, stainless steel enclosure that protects the logger from corrosion, impact and moisture, the unit is rated to IP67 / NEMA 4X standards and can be

LISTED UNDER: Cooling & Thermal Management | Test & Measurement

Die-bonding Materials Suit (HB) LED Packaging Apps

October 9, 2009 11:48 am | Product Releases | Comments

Shin-Etsu’s KER Series was developed as a die encapsulation, die-attach adhesive, and lens-type material to provide long-term reliability for applications in general-purpose lighting and the rapidly expanding HBLED category. This methyl silicone based system hardens by using a heat cured platinum catalyst.

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects

Epoxy Handles up to 600°F

October 9, 2009 5:28 am | Product Releases | Comments

Addressing demanding applications from downhole oil drilling to turbo compressors and satellite modules, Master Bond's EP46HT-1 epoxy adhesive/sealant has a continuous service operating temperature range of -100°F to +550°F and can withstand intermittent exposures up to 600°F.

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects
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Temp Sensor Boasts High Accuracy

October 8, 2009 7:33 am | Microchip Technology Inc. | Product Releases | Comments

With a static current consumption of just 200 µA, the MCP9804 Temperature Sensor from Microchip has a temperature accuracy of +/- 1° C from -40 to +125°C. Available in an 8-pin MSOP or 2 mm x 3 mm DFN package

LISTED UNDER: Cooling & Thermal Management | Sensors & Actuators

Thermal Adhesive Film Assures Reliable Component Operation

September 30, 2009 11:06 am | Product Releases | Comments

Master Bond has introduced a thermal adhesive film called FL901AO. It is formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices. The 100 percent solid, B-stage adhesive-preform provides a high bond strength solution to

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects

Brushless Fans feature static pressure as low as .83 in

September 24, 2009 7:14 am | Product Releases | Comments

With .83 in to 1.2 in static pressure, two new sizes in the "REVOLUTION" series of brushless DC fans from Jaro Thermal achieve up to 316 cfm. The new sizes include 140 MM2 x 51 MM and 120 mm2 x 38 mm. The fans' rated voltage is from 12 VDC to 24 VDC, while the operating voltage range is from 10.8 VDC to 26.4 VDC.

LISTED UNDER: Cooling & Thermal Management | Electromechanical/Mechanical Devices

Potting Compound Protects Heat-Sensitive Parts

September 16, 2009 7:44 am | Product Releases | Comments

Containing no solvents or diluents, Master Bond's EP30M3LV low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations.

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects

Fan Trays cover Depths from 250-350 mm

September 14, 2009 8:34 am | Product Releases | Comments

Designed to provide localised cooling of 19" rack mounted or desktop equipment, the range of 19” 1U standard fan trays from Verotec consists of two depths--a 250 mm deep unit fitted with three fans and a 350 mm deep unit with six fans. The trays are populated with fans operating from 12 VDC, 24 VDC, or 48 VDC, or 115 VAC or 230 VAC

LISTED UNDER: Cooling & Thermal Management | Electromechanical/Mechanical Devices

Thermal Management Software Builds Models Entirely From Intelligent Objects

August 3, 2009 10:43 am | Product Releases | Comments

Future Facilities has introduced its 6SigmaET electronic cooling software. It is capable of building the model entirely from intelligent objects which speeds up model creation, enables automatic gridding and simplifies post-processing. It supports the

LISTED UNDER: Cooling & Thermal Management | Electromechanical/Mechanical Devices

Adhesive Optimizes Heat Dissipation

August 3, 2009 10:17 am | Product Releases | Comments

Featuring thermal conductivity and electrical insulation properties, the EP30BN boron nitride epoxy adhesive from Master Bond is designed to optimize heat dissipation of aerospace, defense and microelectronic assemblies. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Temperature range is from -60°F to 300°F ( 50°C to 150°C).

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects

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