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Curtiss-Wright Controls Announces Thermal Management Technology Breakthrough

December 28, 2010 4:29 am | Product Releases | Comments

Curtiss-Wright Controls Electronic Systems has announced that recent testing of its new (patent pending) CoolWall technology for thermal management of rugged embedded computing enclosures has shown a greater than 2x improvement in payload power cooling...

LISTED UNDER: Cooling & Thermal Management

Outdoor Thermoelectric Coolers offer Bi-Polar Thermostatic Control

December 22, 2010 4:22 am | Product Releases | Comments

Laird Technologies announced the release of its new Outdoor Thermoelectric Cooler Series with Bi-Polar Thermostatic Control.

LISTED UNDER: Cooling & Thermal Management

Electronics cooler is only 0.6mm high

December 1, 2010 8:42 am | Product Releases | Comments

Nextreme Thermal Solutions today introduces the eTEC HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements.

LISTED UNDER: Boards & Modules | Cooling & Thermal Management
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Power Generator Serves Self-powered Distributed Sensors and Sensor Networks

November 17, 2010 8:53 am | Product Releases | Comments

Nextreme Thermal Solutions announced the availability of the new eTEG(TM) HV37 thermoelectric power generator, the next entry in the high-voltage (HV) series of clean energy generators based on thin-film thermoelectrics.

LISTED UNDER: Cooling & Thermal Management

Nextreme Scales Up with New eTEC HV56 Electronics Cooler

November 10, 2010 5:06 am | Product Releases | Comments

Nextreme Thermal Solutions today introduces the eTEC(TM) HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements.

LISTED UNDER: Cooling & Thermal Management

Revolutionary heat transfer material to be launched at electronica

November 9, 2010 4:29 am | Product Releases | Comments

Elektron Ventures is today unveiling a brand new porous copper material that will transform cooling systems and enable faster processing clock speeds. AdvarienCu - a pioneering copper foam created using a patented process...

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects

General Electric Adopts 'EcoView Residential’ Energy Management System

September 21, 2010 12:27 pm | Product Releases | Comments

Advanced Telemetry (www.AdvancedTelemetry.com), developer of the EcoView smart energy management system for light commercial and residential applications, today announced that General Electric Co. has adopted its “EcoView Residential” solution...

LISTED UNDER: Cooling & Thermal Management

Sensor System Presents as Ensuring Optimal Heat Sink Efficiency

September 2, 2010 7:58 am | Product Releases | Comments

The Tactilus heat-sink analysis system by Sensor Products Inc. enables engineers to visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, it

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects | Sensors & Actuators
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Fujipoly Releases Sticky Thermal Solution

September 1, 2010 9:40 am | Product Releases | Comments

Fujipoly announces the introduction of Sarcon GR-Tac, a highly conformable and durable .25mm thick polyester reinforced thermal interface material. Sarcon 25GR-Tac is easy to install and typically does not require adhesive due to its naturally tacky consistency.

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects

Rehm Thermal Systems shows Solar Equipment for Metallization Lines

August 16, 2010 4:59 am | Product Releases | Comments

Rehm Thermal Systems presents an advanced new series of drying systems and firing systems for solar cell metallization at EU PVSEC in Valencia, September 6-9, 2010. These Systems offer a range of advanced process features and thermal control that enable PV manufacturers to move their processes to an entirely new level of efficiency and yield.

LISTED UNDER: Cooling & Thermal Management

Thermoelectric Assemblies Achieve High Cooling Capacities

August 6, 2010 7:41 am | Product Releases | Comments

Laird Technologies, Inc. announced the release of its enhanced Cascade Series Thermoelectric Assemblies (TEAs). These custom designed cooling assemblies use multistage Thermoelectric Modules (TEMs) to

LISTED UNDER: Boards & Modules | Cooling & Thermal Management | Electromechanical/Mechanical Devices

Tiny Water-Resistant Fan Delivers High Output

June 22, 2010 8:36 am | Product Releases | Comments

Providing an output of 0.57 CFM,  Jaro's newest ultra-thin, micro-sized (15 x 4) fan has an IP 57 (water resistant) rating

LISTED UNDER: Cooling & Thermal Management

Transparent Heaters Control Temp of Optical, Lens and Display Assemblies

June 18, 2010 12:41 pm | Product Releases | Comments

Dontech Therma Klear transparent heaters provide the warmth necessary to extend the operating temperature of liquid crystal displays (LCDs) in cold environments (e.g., from 0° to below -40°C) and for the anti-fog, anti-icing, and de-icing of

LISTED UNDER: Cooling & Thermal Management | Optoelectronics & Displays | Packaging & Interconnects

Thermometer Touts Wide Termperature Range

June 17, 2010 8:07 am | Product Releases | Comments

Control Company’s Traceable Memory Wide-Range Thermometer temperature range covers –328 to 2,498°F and –200 to 1,370°C. Resolution is 0.1 from –200 to 640°C (–328 to 990°F), otherwise 1°; and meter only accuracy is ±1°C. Supplied stainless-steel, triple-purpose, a Type-K thermocouple probe may be used to

LISTED UNDER: Cooling & Thermal Management | Test & Measurement

Epoxy With High Thermal Conductivity Meets NASA Low Outgassing Specs

June 17, 2010 7:18 am | Product Releases | Comments

Master Bond’s Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring exceptional electrical insulation and toughness. It meets NASA low outgassing specifications and has

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects | Packaging & Interconnects

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