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Revolutionary heat transfer material to be launched at electronica

November 9, 2010 4:29 am | Product Releases | Comments

Elektron Ventures is today unveiling a brand new porous copper material that will transform cooling systems and enable faster processing clock speeds. AdvarienCu - a pioneering copper foam created using a patented process...

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects
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General Electric Adopts 'EcoView Residential’ Energy Management System

September 21, 2010 12:27 pm | Product Releases | Comments

Advanced Telemetry (www.AdvancedTelemetry.com), developer of the EcoView smart energy management system for light commercial and residential applications, today announced that General Electric Co. has adopted its “EcoView Residential” solution...

LISTED UNDER: Cooling & Thermal Management

Sensor System Presents as Ensuring Optimal Heat Sink Efficiency

September 2, 2010 7:58 am | Product Releases | Comments

The Tactilus heat-sink analysis system by Sensor Products Inc. enables engineers to visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, it

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects | Sensors & Actuators

Fujipoly Releases Sticky Thermal Solution

September 1, 2010 9:40 am | Product Releases | Comments

Fujipoly announces the introduction of Sarcon GR-Tac, a highly conformable and durable .25mm thick polyester reinforced thermal interface material. Sarcon 25GR-Tac is easy to install and typically does not require adhesive due to its naturally tacky consistency.

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects

Rehm Thermal Systems shows Solar Equipment for Metallization Lines

August 16, 2010 4:59 am | Product Releases | Comments

Rehm Thermal Systems presents an advanced new series of drying systems and firing systems for solar cell metallization at EU PVSEC in Valencia, September 6-9, 2010. These Systems offer a range of advanced process features and thermal control that enable PV manufacturers to move their processes to an entirely new level of efficiency and yield.

LISTED UNDER: Cooling & Thermal Management

Thermoelectric Assemblies Achieve High Cooling Capacities

August 6, 2010 7:41 am | Product Releases | Comments

Laird Technologies, Inc. announced the release of its enhanced Cascade Series Thermoelectric Assemblies (TEAs). These custom designed cooling assemblies use multistage Thermoelectric Modules (TEMs) to

LISTED UNDER: Boards & Modules | Cooling & Thermal Management | Electromechanical/Mechanical Devices

Tiny Water-Resistant Fan Delivers High Output

June 22, 2010 8:36 am | Product Releases | Comments

Providing an output of 0.57 CFM,  Jaro's newest ultra-thin, micro-sized (15 x 4) fan has an IP 57 (water resistant) rating

LISTED UNDER: Cooling & Thermal Management

Transparent Heaters Control Temp of Optical, Lens and Display Assemblies

June 18, 2010 12:41 pm | Product Releases | Comments

Dontech Therma Klear transparent heaters provide the warmth necessary to extend the operating temperature of liquid crystal displays (LCDs) in cold environments (e.g., from 0° to below -40°C) and for the anti-fog, anti-icing, and de-icing of

LISTED UNDER: Cooling & Thermal Management | Optoelectronics & Displays | Packaging & Interconnects

Thermometer Touts Wide Termperature Range

June 17, 2010 8:07 am | Product Releases | Comments

Control Company’s Traceable Memory Wide-Range Thermometer temperature range covers –328 to 2,498°F and –200 to 1,370°C. Resolution is 0.1 from –200 to 640°C (–328 to 990°F), otherwise 1°; and meter only accuracy is ±1°C. Supplied stainless-steel, triple-purpose, a Type-K thermocouple probe may be used to

LISTED UNDER: Cooling & Thermal Management | Test & Measurement

Epoxy With High Thermal Conductivity Meets NASA Low Outgassing Specs

June 17, 2010 7:18 am | Product Releases | Comments

Master Bond’s Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring exceptional electrical insulation and toughness. It meets NASA low outgassing specifications and has

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects | Packaging & Interconnects

Thermostatic Controller Adds Integrated Temperature Control to Most Thermoelectric Assemblies

February 3, 2010 5:41 am | Product Releases | Comments

Laird Technologies announced its new Q Series Thermostatic Controller for most Thermoelectric Assemblies (TEAs). The Q Series Thermostatic Controller is a microcontroller-based device that adds integrated temperature control to a TEA. The controller functions as a 

LISTED UNDER: Boards & Modules | Cooling & Thermal Management | Electromechanical/Mechanical Devices

Surface Mount Resistor is Thermally Efficient

January 27, 2010 11:39 am | Product Releases | Comments

The HPC series from Stackpole is a compact surface mount 5 watt resistor. The HPC Series incorporates four parallel thick film chip resistor elements to accommodate the higher power handling and the anodized heat sink allows for increased heat dissipation into the ambient air. These parallel resistance elements allow the HPC Series to withstand up to 2500 watts for pulse durations of 100 microseconds or less.

LISTED UNDER: Cooling & Thermal Management

Spot-Cooling Tech Uses Turbulent Air

December 3, 2009 10:14 am | Product Releases | Comments

JaroThermal announced the introduction of its brand new NtelliJet series of Low-Profile coolers today. The new low-acoustic cooler uses rapid-fire pulses of turbulent air (produced by an oscillating diaphragm working between 50 and 200hz ) to cool heatsinks and surrounding components.

LISTED UNDER: Cooling & Thermal Management

High Temperature USB Data Logger Comes In Stainless Steel Housing

December 3, 2009 8:39 am | Product Releases | Comments

The EL-USB-1-PRO is a high temperature USB data logger capable of measuring and recording over 32,000 temperature readings from -40°F to +257°F/-40°C to +125°C. Housed in a waterproof, stainless steel enclosure that protects the logger from corrosion, impact and moisture, the unit is rated to IP67 / NEMA 4X standards and can be

LISTED UNDER: Cooling & Thermal Management | Test & Measurement

Die-bonding Materials Suit (HB) LED Packaging Apps

October 9, 2009 11:48 am | Product Releases | Comments

Shin-Etsu’s KER Series was developed as a die encapsulation, die-attach adhesive, and lens-type material to provide long-term reliability for applications in general-purpose lighting and the rapidly expanding HBLED category. This methyl silicone based system hardens by using a heat cured platinum catalyst.

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects

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