Rehm Thermal Systems shows Solar Equipment for Metallization Lines
August 16, 2010 4:59 am | Product Releases | CommentsRehm Thermal Systems presents an advanced new series of drying systems and firing systems for solar cell metallization at EU PVSEC in Valencia, September 6-9, 2010. These Systems offer a range of advanced process features and thermal control that enable PV manufacturers to move their processes to an entirely new level of efficiency and yield.
LISTED UNDER: Cooling & Thermal Management
Thermoelectric Assemblies Achieve High Cooling Capacities
August 6, 2010 7:41 am | Product Releases | CommentsLaird Technologies, Inc. announced the release of its enhanced Cascade Series Thermoelectric Assemblies (TEAs). These custom designed cooling assemblies use multistage Thermoelectric Modules (TEMs) to
LISTED UNDER: Boards & Modules | Cooling & Thermal Management | Electromechanical/Mechanical Devices
Tiny Water-Resistant Fan Delivers High Output
June 22, 2010 8:36 am | Product Releases | CommentsProviding an output of 0.57 CFM, Jaro's newest ultra-thin, micro-sized (15 x 4) fan has an IP 57 (water resistant) rating
LISTED UNDER: Cooling & Thermal Management
Transparent Heaters Control Temp of Optical, Lens and Display Assemblies
June 18, 2010 12:41 pm | Product Releases | CommentsDontech Therma Klear transparent heaters provide the warmth necessary to extend the operating temperature of liquid crystal displays (LCDs) in cold environments (e.g., from 0° to below -40°C) and for the anti-fog, anti-icing, and de-icing of
LISTED UNDER: Cooling & Thermal Management | Optoelectronics & Displays | Packaging & Interconnects
Thermometer Touts Wide Termperature Range
June 17, 2010 8:07 am | Product Releases | CommentsControl Company’s Traceable Memory Wide-Range Thermometer temperature range covers –328 to 2,498°F and –200 to 1,370°C. Resolution is 0.1 from –200 to 640°C (–328 to 990°F), otherwise 1°; and meter only accuracy is ±1°C. Supplied stainless-steel, triple-purpose, a Type-K thermocouple probe may be used to
LISTED UNDER: Cooling & Thermal Management | Test & Measurement
Epoxy With High Thermal Conductivity Meets NASA Low Outgassing Specs
June 17, 2010 7:18 am | Product Releases | CommentsMaster Bond’s Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring exceptional electrical insulation and toughness. It meets NASA low outgassing specifications and has
LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects | Packaging & Interconnects
Thermostatic Controller Adds Integrated Temperature Control to Most Thermoelectric Assemblies
February 3, 2010 5:41 am | Product Releases | CommentsLaird Technologies announced its new Q Series Thermostatic Controller for most Thermoelectric Assemblies (TEAs). The Q Series Thermostatic Controller is a microcontroller-based device that adds integrated temperature control to a TEA. The controller functions as a
LISTED UNDER: Boards & Modules | Cooling & Thermal Management | Electromechanical/Mechanical DevicesSurface Mount Resistor is Thermally Efficient
January 27, 2010 11:39 am | Product Releases | CommentsThe HPC series from Stackpole is a compact surface mount 5 watt resistor. The HPC Series incorporates four parallel thick film chip resistor elements to accommodate the higher power handling and the anodized heat sink allows for increased heat dissipation into the ambient air. These parallel resistance elements allow the HPC Series to withstand up to 2500 watts for pulse durations of 100 microseconds or less.
LISTED UNDER: Cooling & Thermal Management
Spot-Cooling Tech Uses Turbulent Air
December 3, 2009 10:14 am | Product Releases | CommentsJaroThermal announced the introduction of its brand new NtelliJet series of Low-Profile coolers today. The new low-acoustic cooler uses rapid-fire pulses of turbulent air (produced by an oscillating diaphragm working between 50 and 200hz ) to cool heatsinks and surrounding components.
LISTED UNDER: Cooling & Thermal Management
High Temperature USB Data Logger Comes In Stainless Steel Housing
December 3, 2009 8:39 am | Product Releases | CommentsThe EL-USB-1-PRO is a high temperature USB data logger capable of measuring and recording over 32,000 temperature readings from -40°F to +257°F/-40°C to +125°C. Housed in a waterproof, stainless steel enclosure that protects the logger from corrosion, impact and moisture, the unit is rated to IP67 / NEMA 4X standards and can be
LISTED UNDER: Cooling & Thermal Management | Test & Measurement
Temperature Control in Large Enclosed Spaces
November 18, 2009 9:58 am | by Marc Dugré, President, Regulvar | Articles | CommentsTemperature control in large enclosed spaces - such as goods warehouses or aircraft hangars – presents a huge challenge to conventional technologies. As such, this type of environment is very expensive to heat or cool and uncomfortable to work in. Innovative wireless technology can provide the answer.
LISTED UNDER: Cooling & Thermal Management
Die-bonding Materials Suit (HB) LED Packaging Apps
October 9, 2009 11:48 am | Product Releases | CommentsShin-Etsu’s KER Series was developed as a die encapsulation, die-attach adhesive, and lens-type material to provide long-term reliability for applications in general-purpose lighting and the rapidly expanding HBLED category. This methyl silicone based system hardens by using a heat cured platinum catalyst.
LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects
Epoxy Handles up to 600°F
October 9, 2009 5:28 am | Product Releases | CommentsAddressing demanding applications from downhole oil drilling to turbo compressors and satellite modules, Master Bond's EP46HT-1 epoxy adhesive/sealant has a continuous service operating temperature range of -100°F to +550°F and can withstand intermittent exposures up to 600°F.
LISTED UNDER: Cooling & Thermal Management | Packaging & InterconnectsTemp Sensor Boasts High Accuracy
October 8, 2009 7:33 am | Microchip Technology Inc. | Product Releases | CommentsWith a static current consumption of just 200 µA, the MCP9804 Temperature Sensor from Microchip has a temperature accuracy of +/- 1° C from -40 to +125°C. Available in an 8-pin MSOP or 2 mm x 3 mm DFN package
LISTED UNDER: Cooling & Thermal Management | Sensors & ActuatorsThermal Adhesive Film Assures Reliable Component Operation
September 30, 2009 11:06 am | Product Releases | CommentsMaster Bond has introduced a thermal adhesive film called FL901AO. It is formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices. The 100 percent solid, B-stage adhesive-preform provides a high bond strength solution to
LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects