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Preheating system reduces press cure time by 50%

February 15, 2011 5:24 am | Product Releases | Comments

A New Preheating System for plastic sheet molding compound (SMC) that uses Radio Frequency Heating Technology is being introduced by Radio Frequency Co., Inc. of Millis, Massachusetts. This new system is reported to enhance the distribution of reinforcement fibers...

LISTED UNDER: Cooling & Thermal Management

EC Plug Fans Provide Energy Efficient Precision Cooling

January 14, 2011 4:42 am | Product Releases | Comments

In response to the increasing needs for data center and IT managers to both reduce costs and increase availability, Emerson Network Power has extended electrically commutated (EC) plug fans to all down-flow models of Liebert CW and Liebert DS precision cooling systems...

LISTED UNDER: Cooling & Thermal Management | Electromechanical/Mechanical Devices

Curtiss-Wright Controls Announces Thermal Management Technology Breakthrough

December 28, 2010 4:29 am | Product Releases | Comments

Curtiss-Wright Controls Electronic Systems has announced that recent testing of its new (patent pending) CoolWall technology for thermal management of rugged embedded computing enclosures has shown a greater than 2x improvement in payload power cooling...

LISTED UNDER: Cooling & Thermal Management
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Outdoor Thermoelectric Coolers offer Bi-Polar Thermostatic Control

December 22, 2010 4:22 am | Product Releases | Comments

Laird Technologies announced the release of its new Outdoor Thermoelectric Cooler Series with Bi-Polar Thermostatic Control.

LISTED UNDER: Cooling & Thermal Management

Electronics cooler is only 0.6mm high

December 1, 2010 8:42 am | Product Releases | Comments

Nextreme Thermal Solutions today introduces the eTEC HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements.

LISTED UNDER: Boards & Modules | Cooling & Thermal Management

Power Generator Serves Self-powered Distributed Sensors and Sensor Networks

November 17, 2010 8:53 am | Product Releases | Comments

Nextreme Thermal Solutions announced the availability of the new eTEG(TM) HV37 thermoelectric power generator, the next entry in the high-voltage (HV) series of clean energy generators based on thin-film thermoelectrics.

LISTED UNDER: Cooling & Thermal Management

Nextreme Scales Up with New eTEC HV56 Electronics Cooler

November 10, 2010 5:06 am | Product Releases | Comments

Nextreme Thermal Solutions today introduces the eTEC(TM) HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements.

LISTED UNDER: Cooling & Thermal Management

Revolutionary heat transfer material to be launched at electronica

November 9, 2010 4:29 am | Product Releases | Comments

Elektron Ventures is today unveiling a brand new porous copper material that will transform cooling systems and enable faster processing clock speeds. AdvarienCu - a pioneering copper foam created using a patented process...

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects
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General Electric Adopts 'EcoView Residential’ Energy Management System

September 21, 2010 12:27 pm | Product Releases | Comments

Advanced Telemetry (www.AdvancedTelemetry.com), developer of the EcoView smart energy management system for light commercial and residential applications, today announced that General Electric Co. has adopted its “EcoView Residential” solution...

LISTED UNDER: Cooling & Thermal Management

Sensor System Presents as Ensuring Optimal Heat Sink Efficiency

September 2, 2010 7:58 am | Product Releases | Comments

The Tactilus heat-sink analysis system by Sensor Products Inc. enables engineers to visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, it

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects | Sensors & Actuators

Fujipoly Releases Sticky Thermal Solution

September 1, 2010 9:40 am | Product Releases | Comments

Fujipoly announces the introduction of Sarcon GR-Tac, a highly conformable and durable .25mm thick polyester reinforced thermal interface material. Sarcon 25GR-Tac is easy to install and typically does not require adhesive due to its naturally tacky consistency.

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects

Rehm Thermal Systems shows Solar Equipment for Metallization Lines

August 16, 2010 4:59 am | Product Releases | Comments

Rehm Thermal Systems presents an advanced new series of drying systems and firing systems for solar cell metallization at EU PVSEC in Valencia, September 6-9, 2010. These Systems offer a range of advanced process features and thermal control that enable PV manufacturers to move their processes to an entirely new level of efficiency and yield.

LISTED UNDER: Cooling & Thermal Management

Thermoelectric Assemblies Achieve High Cooling Capacities

August 6, 2010 7:41 am | Product Releases | Comments

Laird Technologies, Inc. announced the release of its enhanced Cascade Series Thermoelectric Assemblies (TEAs). These custom designed cooling assemblies use multistage Thermoelectric Modules (TEMs) to

LISTED UNDER: Boards & Modules | Cooling & Thermal Management | Electromechanical/Mechanical Devices

Tiny Water-Resistant Fan Delivers High Output

June 22, 2010 8:36 am | Product Releases | Comments

Providing an output of 0.57 CFM,  Jaro's newest ultra-thin, micro-sized (15 x 4) fan has an IP 57 (water resistant) rating

LISTED UNDER: Cooling & Thermal Management

Transparent Heaters Control Temp of Optical, Lens and Display Assemblies

June 18, 2010 12:41 pm | Product Releases | Comments

Dontech Therma Klear transparent heaters provide the warmth necessary to extend the operating temperature of liquid crystal displays (LCDs) in cold environments (e.g., from 0° to below -40°C) and for the anti-fog, anti-icing, and de-icing of

LISTED UNDER: Cooling & Thermal Management | Optoelectronics & Displays | Packaging & Interconnects

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