Low Resistance Gold Plated Connector

May 1, 2013 3:47 pm | Fujipoly America | Products

Fujipoly’s Zebra® Gold Series 8000B is a high performance, low resistance connector that is capable of transferring both data and power between parallel components or circuit boards.This interconnect device is constructed from a low durometer silicone core that is covered with 133 parallel rows of flat, gold-plated wires per inch. This unique construction allows the connector to accommodate PCBs with pad center spacing down to 0.19mm. In addition, each 0.05mm x 0.10mm gold-plated element delivers a current carrying capacity of 500mA while exhibiting a typical electrical resistance of less than 25 milliohms on a 0.635mm wide contact pad.

LISTED UNDER: Computer | Flexible | Multi-layer

Dispensable thermal pads tout desirable performance for LED lamps, luminaires

April 24, 2013 11:41 am | Product Releases | Comments

Dow Corning introduced new Dispensable Thermal Pads, which are positioned as providing cost-effective thermal management in LED lighting applications. The new materials are said to enable LED lamp and luminaire manufacturers t

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Coolers designed for low-profile applications

March 6, 2013 9:52 am | Product Releases | Comments

By embedding a leading-edge 50x50x13 mm fan inside of a skived-copper-fin heatsink, Jaro's unique "Skive" Cooler significantly reduces height requirements for low-profile applications, while providing unsurpassed surface-area. The dense arrangement of thin copper fins offers unheralded thermal conductivity.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Low-viscosity thermally conductive silicone compound fills all unwanted gaps up to 0.50mm in height

March 4, 2013 10:55 am | Product Releases | Comments

Fujipoly announces the introduction of SARCON® SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to 0.50mm in height. 

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Thermal imaging test kits designed for research, development, and machine vision applications

February 21, 2013 3:13 pm | Product Releases | Comments

FLIR Systems introduces its new FLIR A5sc, A15sc, and A35sc longwave infrared thermal imaging camera kits. Designed specifically for thermal bench top testing applications and easy deployment in tight machine vision locations, AX5sc cameras are available in a variety of pixel resolutions from 80×64 and 160×128 up to 320×256....

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | Temperature

IP55-rated AC fans designed for rugged environments

February 19, 2013 1:48 pm | Product Releases | Comments

Orion Fans has expanded its product offering to include IP55-rated versions of its OA Series AC fans, making them ideal for rugged, harsh environment applications. These fans feature diecast aluminum frames and a dual ball bearing system to deliver a reliable and quiet cooling solution.


Thermal interface material designed to transfer heat to heat sink

January 29, 2013 4:13 pm | Fujipoly America | Product Releases | Comments

Fujipoly announces the availability of Sarcon50GR-Ae, an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink. The unique physical properties of this material allow it to protect delicate board-level components as it fills unwanted air gaps and levels uneven surfaces.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

80x80x76mm "Turbo" Fan surpasses static pressure barrier

January 21, 2013 9:16 am | Product Releases | Comments

Spinning at over 19,000 rpm's, JARO's new 80mm x 76mm combination of counter-rotating fans exceeds the static pressure barrier by reaching an unheralded 10 inches of static pressure (in H20). To achieve such a forceful level of "super-cooled" air flow (136.41 CFM), the stability, power consumption, vibration & speed of these new Turbo Fans are all tightly monitored & controlled.


Cold plate four-pass heatsinks provide maximum heat removal

October 17, 2012 10:33 am | Product Releases | Comments

Ohmite Manufacturing Company announces the  CP4 Series of cold plate four-pass heatsinks. These liquid coldplates are designed for Ohmite heatsinkable type resistors, including the TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages.

LISTED UNDER: Cooling & Thermal Management

AC fan-cooling solutions serve electric vehicle charging systems

October 11, 2012 9:57 am | Product Releases | Comments

Dallas-based Orion Fans, a division of Knight Electronics, has developed a thermally-controlled series of AC fans designed for electric vehicle (EV) charging systems. The smart AC axial fans feature a ball-bearing design that can deliver airflows up to 100 CFM...

LISTED UNDER: Cooling & Thermal Management

Non-contact infrared temp. transmitters features a response time of 240mS

August 3, 2012 4:27 pm | Product Releases | Comments

Omega introduces its new series of non-contact infrared temperature transmitters.

LISTED UNDER: Cooling & Thermal Management

Three phase bridge assemblies feature low thermal resistance for increased output current

July 6, 2012 11:09 am | Product Releases | Comments

Solid State Devices, Inc. announced their enhanced SDA312A - SDA312G and SDA312AF - SDA312GF series of three phase bridge assemblies.

LISTED UNDER: Boards & Modules | Cooling & Thermal Management | Packaging & Interconnects

Air conditioning unit delivers up to 33,000 BTU of efficient cooling

June 11, 2012 10:09 am | Product Releases | Comments

Tripp Lite has introduced a new energy-saving, row-based air conditioning unit. The SRCOOL33K has a 42U rack form factor and delivers up to 33,000 BTU of efficient cooling for high-density rack installations in data centers, server rooms and network closets.

LISTED UNDER: Cooling & Thermal Management

Ceramic heaters can operate in atmospheric and vacuum environments up to 1652°F

April 20, 2012 1:40 pm | Product Releases | Comments

Durex Industries recently announced the release of its new Advanced Ceramic Heater technology. Durex Industries’ ceramic heater technology is available in either Aluminum Nitride (AlN) or Alumina (Al2O3). Ceramic heater technologies offer significant advantages over metal based sheath heaters...

LISTED UNDER: Cooling & Thermal Management

Heat Sinks Accommodate Higher Power Densities

February 13, 2012 10:58 am | Product Releases | Comments

By adding a cam-clip and eliminating the need for a screw hole, the rear side of Ohmite’s new R Series heat sink benefits from being fully populated with extra fins which provide a larger cooling surface area and

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects | Packaging & Interconnects


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