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IP55-rated AC fans designed for rugged environments

February 19, 2013 1:48 pm | Product Releases | Comments

Orion Fans has expanded its product offering to include IP55-rated versions of its OA Series AC fans, making them ideal for rugged, harsh environment applications. These fans feature diecast aluminum frames and a dual ball bearing system to deliver a reliable and quiet cooling solution.

LISTED UNDER: Housings
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Thermal interface material designed to transfer heat to heat sink

January 29, 2013 4:13 pm | Fujipoly America | Product Releases | Comments

Fujipoly announces the availability of Sarcon50GR-Ae, an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink. The unique physical properties of this material allow it to protect delicate board-level components as it fills unwanted air gaps and levels uneven surfaces.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

80x80x76mm "Turbo" Fan surpasses static pressure barrier

January 21, 2013 9:16 am | Product Releases | Comments

Spinning at over 19,000 rpm's, JARO's new 80mm x 76mm combination of counter-rotating fans exceeds the static pressure barrier by reaching an unheralded 10 inches of static pressure (in H20). To achieve such a forceful level of "super-cooled" air flow (136.41 CFM), the stability, power consumption, vibration & speed of these new Turbo Fans are all tightly monitored & controlled.

LISTED UNDER: Axial

Cold plate four-pass heatsinks provide maximum heat removal

October 17, 2012 10:33 am | Product Releases | Comments

Ohmite Manufacturing Company announces the  CP4 Series of cold plate four-pass heatsinks. These liquid coldplates are designed for Ohmite heatsinkable type resistors, including the TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages.

LISTED UNDER: Cooling & Thermal Management

AC fan-cooling solutions serve electric vehicle charging systems

October 11, 2012 9:57 am | Product Releases | Comments

Dallas-based Orion Fans, a division of Knight Electronics, has developed a thermally-controlled series of AC fans designed for electric vehicle (EV) charging systems. The smart AC axial fans feature a ball-bearing design that can deliver airflows up to 100 CFM...

LISTED UNDER: Cooling & Thermal Management

Non-contact infrared temp. transmitters features a response time of 240mS

August 3, 2012 4:27 pm | Product Releases | Comments

Omega introduces its new series of non-contact infrared temperature transmitters.

LISTED UNDER: Cooling & Thermal Management

Three phase bridge assemblies feature low thermal resistance for increased output current

July 6, 2012 11:09 am | Product Releases | Comments

Solid State Devices, Inc. announced their enhanced SDA312A - SDA312G and SDA312AF - SDA312GF series of three phase bridge assemblies.

LISTED UNDER: Boards & Modules | Cooling & Thermal Management | Packaging & Interconnects

Air conditioning unit delivers up to 33,000 BTU of efficient cooling

June 11, 2012 10:09 am | Product Releases | Comments

Tripp Lite has introduced a new energy-saving, row-based air conditioning unit. The SRCOOL33K has a 42U rack form factor and delivers up to 33,000 BTU of efficient cooling for high-density rack installations in data centers, server rooms and network closets.

LISTED UNDER: Cooling & Thermal Management

Ceramic heaters can operate in atmospheric and vacuum environments up to 1652°F

April 20, 2012 1:40 pm | Product Releases | Comments

Durex Industries recently announced the release of its new Advanced Ceramic Heater technology. Durex Industries’ ceramic heater technology is available in either Aluminum Nitride (AlN) or Alumina (Al2O3). Ceramic heater technologies offer significant advantages over metal based sheath heaters...

LISTED UNDER: Cooling & Thermal Management

Heat Sinks Accommodate Higher Power Densities

February 13, 2012 10:58 am | Product Releases | Comments

By adding a cam-clip and eliminating the need for a screw hole, the rear side of Ohmite’s new R Series heat sink benefits from being fully populated with extra fins which provide a larger cooling surface area and

LISTED UNDER: Cooling & Thermal Management | Packaging & Interconnects | Packaging & Interconnects

New iPhone App Helps Optimize Heat Sinks to Cooling Needs

January 4, 2012 3:54 am | Product Releases | Comments

Advanced Thermal Solutions has developed a heat sink design calculator, as an iPhone app, that identifies the proper heat sinks to solve most component-level cooling issues. The app allows engineers to input the essential specs...

LISTED UNDER: Cooling & Thermal Management | Software

Thermistor-RTD Sensor Suits Tower Tanks, Hot Water Heater Apps

December 13, 2011 8:05 am | Product Releases | Comments

Kele Precision Manufacturing announced the latest addition to its line of thermistors and RTD Sensors, the ST-TS* Series. The ST-TS* Series’ sensing element is a highly stable precision thermistor or platinum RTD.

LISTED UNDER: Cooling & Thermal Management | Sensors & Actuators

Coolers Utilize Aerospace Fluid-Bearing Technology

November 21, 2011 8:04 am | Product Releases | Comments

Jaro's new tightly-designed MR-16 LED coolers optimize longevity and temperature with a highly-efficient fluid-bearing structure. At speeds of up to 4200RPM±15%, these very quiet DC coolers provide a chilly, yet quiet air-flow of 1.850CFM (min.: 1.573 CFM).

LISTED UNDER: Cooling & Thermal Management

Compact Cooling Solutions - Mini Fans

October 20, 2011 7:02 am | Product Releases | Comments

California-based Cooltron Industrial Supply, a leading supplier of standard and custom AC and DC fans, trays, and accessories, has a new line of mini compact fans and blowers released.

LISTED UNDER: Cooling & Thermal Management

Fischer Elektronik names Newark-element14 as its sole North American distributor

September 22, 2011 5:20 am | Product Releases | Comments

Newark/element14 announced today that it has signed a franchise agreement with Fischer Elektronik to market its board-level heat sinks for common package semiconductors plus extruded and finger-shaped heat sinks to support LED design and industrial applications.

LISTED UNDER: Cooling & Thermal Management

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