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Heat Sinks & Dissipators

Thermal controller designed to operate with thermoelectric modules

April 2, 2014 1:33 pm | Oven Industries, Inc. | Product Releases | Comments

Oven Industries’ (Mechanicsburg, PA) Model 5R7-350/347 is an economical thermal controller especially designed to operate with thermoelectric (Peltier effect) modules. Most of these modules may be operated in either a cooling mode or a heating mode depending on current direction....

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates
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Miniature thermoelectric modules designed for temperature stabilization applications

January 31, 2014 3:26 pm | Laird Technologies | Product Releases | Comments

Laird has announced a new series of miniature thermoelectric modules (TEMs) built using Laird Tlam thermally conductive circuit boards instead of traditional ceramic-based circuit boards. The Tlam OptoTEC series is designed for applications where temperature stabilization of sensitive optical components...

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Dimensionally stable two component urethane modified epoxy gel is thermally conductive

January 6, 2014 11:58 am | Master Bond Inc. | Product Releases | Comments

Primarily used for potting and encapsulation applications, Master Bond Super Gel 9AO is a soft, urethane modified gel-like epoxy that offers thermal conductivity and electrical insulation properties. This two part system is also employed for

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Airflow controller improves fan testing for electronics thermal management studies

August 12, 2013 3:31 pm | Advanced Thermal Solutions | Product Releases | Comments

Advanced Thermal Solutions, Inc., ATS has introduced the FSC-200Fan Speed Controller for providing precise management of fan speeds during thermal management studies of electronic devices. The FSC-200 comes with ATS stageSPEED software which allows the use of a PC to incrementally control the speed of fan and fan trays from 0 to 100% of their maximum power.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Personal air-conditioning vest re-designed for better comfort and cooling

June 26, 2013 3:57 pm | Product Releases | Comments

ITW Vortec today launched its re-designed and re-engineered Personal Air Conditioning (PAC) vest. The Vortec PAC vest, already praised as an innovative solution to protect industrial workers in extreme temperature environments, now offers even more features to ensure comfort and cooling.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

New option for thermoelectrically cooled electronic enclosures makes washdowns fast and easy

June 10, 2013 1:26 pm | Product Releases | Comments

EIC Solutions has announced the new M74 clean out modification option which facilitates washdown of thermoelectric coolers mounted to electronic enclosures. The M74 option was application-driven arising from suggestions received from customers in food processing, and other process industries requiring frequent rinsing or washing of equipment.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | Metal

Epoxy mount socket operates at bandwidths up to 8 GHz

May 22, 2013 3:12 pm | Ironwood Electronics, Inc. | Product Releases | Comments

Ironwood Electronics has recently introduced a new high-performance BGA socket for 0.8mm pitch BGA 78 pin DDR3 packages. The SG-BGA-6374 socket is designed for an 9x13 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | Ethernet/Internet

Sarcon® 50GR-Ae Thermal Gel Sheets

May 1, 2013 4:01 pm | Fujipoly America | Products

Sarcon® 50GR-Ae is an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink. The unique physical properties of this material allow it to protect delicate board-level components as it fills unwanted air gaps and levels uneven surfaces. This high-performance silicone based compound delivers a thermal conductivity of 1.3 W/m°K with a thermal resistance of only .63 °Cin2/W.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

SARCON® SPG-20A Form-in-Place Thermal Compound

May 1, 2013 3:52 pm | Fujipoly America | Products

Fujipoly announces the introduction of SARCON® SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to .50 mm in height. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C).

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | MERG

Low Resistance Gold Plated Connector

May 1, 2013 3:47 pm | Fujipoly America | Products

Fujipoly’s Zebra® Gold Series 8000B is a high performance, low resistance connector that is capable of transferring both data and power between parallel components or circuit boards.This interconnect device is constructed from a low durometer silicone core that is covered with 133 parallel rows of flat, gold-plated wires per inch. This unique construction allows the connector to accommodate PCBs with pad center spacing down to 0.19mm. In addition, each 0.05mm x 0.10mm gold-plated element delivers a current carrying capacity of 500mA while exhibiting a typical electrical resistance of less than 25 milliohms on a 0.635mm wide contact pad.

LISTED UNDER: Computer | Flexible | Multi-layer

Dispensable thermal pads tout desirable performance for LED lamps, luminaires

April 24, 2013 11:41 am | Product Releases | Comments

Dow Corning introduced new Dispensable Thermal Pads, which are positioned as providing cost-effective thermal management in LED lighting applications. The new materials are said to enable LED lamp and luminaire manufacturers t

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Coolers designed for low-profile applications

March 6, 2013 9:52 am | Product Releases | Comments

By embedding a leading-edge 50x50x13 mm fan inside of a skived-copper-fin heatsink, Jaro's unique "Skive" Cooler significantly reduces height requirements for low-profile applications, while providing unsurpassed surface-area. The dense arrangement of thin copper fins offers unheralded thermal conductivity.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Low-viscosity thermally conductive silicone compound fills all unwanted gaps up to 0.50mm in height

March 4, 2013 10:55 am | Product Releases | Comments

Fujipoly announces the introduction of SARCON® SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to 0.50mm in height. 

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Thermal imaging test kits designed for research, development, and machine vision applications

February 21, 2013 3:13 pm | Product Releases | Comments

FLIR Systems introduces its new FLIR A5sc, A15sc, and A35sc longwave infrared thermal imaging camera kits. Designed specifically for thermal bench top testing applications and easy deployment in tight machine vision locations, AX5sc cameras are available in a variety of pixel resolutions from 80×64 and 160×128 up to 320×256....

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | Temperature

Thermal interface material designed to transfer heat to heat sink

January 29, 2013 4:13 pm | Fujipoly America | Product Releases | Comments

Fujipoly announces the availability of Sarcon50GR-Ae, an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink. The unique physical properties of this material allow it to protect delicate board-level components as it fills unwanted air gaps and levels uneven surfaces.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates
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