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EMI/RFI Shielding

Overmolded backshells on connector interfaces offer improved reliability

February 24, 2014 4:17 pm | Api Technologies | Product Releases | Comments

API Technologies Corp. (Orlando, FL) now offers overmolded backshells on connector interfaces from its Electromagnetic Integrated Solutions (EIS) product line, the leader in EMI/RFI components and interconnects. Ideal for use in military, aerospace, high-end industrial, oil and gas, as well as medical applications...

LISTED UNDER: EMI/RFI Shielding
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