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EMI/RFI Shielding

Conductive foam gaskets have X, Y, & Z axis conductivity

April 1, 2015 1:15 pm | by Tech-Etch Inc. | Tech-Etch Inc. | Product Releases | Comments

Available as standard gaskets, custom designs or sheet stock, durable 2700 Series Conductive Foam has X, Y, and Z axis conductivity for maximum EMI shielding attenuation. The material is ideal for computer, router and telecom I/O shielding. It is offered with or without pressure sensitive conductive adhesive covering ...

LISTED UNDER: EMI/RFI Shielding

EMI/RFI shielding product guide includes unique side-by-side format

February 25, 2015 11:10 am | by Tech-Etch Inc. | Tech-Etch Inc. | Product Releases | Comments

The EMI/RFI Shielding Product Guide from Tech-Etch describes and pictures shielding products in a useful side-by-side comparison format. The eight-page brochure compares mounting, composition, size range, effective compression range, type of seal, contact interface, and performance data....

LISTED UNDER: EMI/RFI Shielding

Gaskets achieve EMI/RFI shielding effectiveness over 100db attenuation

February 3, 2015 10:14 am | by Tech-Etch Inc. | Tech-Etch Inc. | Product Releases | Comments

Popular Low-Profile BeCu gaskets from Tech-Etch are offered in Stick-on, Hook & Stick-on and Clip-on mounting configurations. With EMI/RFI shielding effectiveness over 100db attenuation, the gaskets have free heights from .06" to .15" high and will close ...

LISTED UNDER: Gaskets | EMI/RFI Shielding
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Heat-shrink cable shielding suits medical applications

June 2, 2014 9:51 am | Methode Electronics, Inc. | Product Releases | Comments

Methode Electronics, Inc. (Chicago, IL) announced the release of its new medical grade shrinkMate shielding heat-shrink tubing. Using clear medical grade polyester, the lightweight tubing shrinks over the object when heat is applied and forms a

LISTED UNDER: EMI/RFI Shielding

Overmolded backshells on connector interfaces offer improved reliability

February 24, 2014 4:17 pm | Api Technologies | Product Releases | Comments

API Technologies Corp. (Orlando, FL) now offers overmolded backshells on connector interfaces from its Electromagnetic Integrated Solutions (EIS) product line, the leader in EMI/RFI components and interconnects. Ideal for use in military, aerospace, high-end industrial, oil and gas, as well as medical applications...

LISTED UNDER: EMI/RFI Shielding
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