Advertisement
Chips

Miniature chip bead ferrite comes in 0201 package

April 24, 2014 5:06 pm | Wurth Electronics Midcom, Inc. | Product Releases | Comments

Miniaturization of electronic circuits not only requires small components, but also interference-free operation. With the WE-TMSB product family, Würth Elektronik eiSos offers the smallest chip bead ferrite in the standard 0201 chip format. This package design increases packing density of components....

LISTED UNDER: Chips

Polymer tantalum capacitors well-suited for automotive infotainment systems

April 7, 2014 12:34 pm | Kemet Electronics Corporation | Product Releases | Comments

KEMET Corporation (Greenville, SC) presented its most recent product performance results for polymer tantalum capacitors developed according to the Automotive Electronics Council (AEC) Q200 Reliability Document at the 2014 CARTS International Conference in Santa Clara, CA....

LISTED UNDER: Chips

Tantalum chip capacitors designed for high-energy applications

December 11, 2013 10:15 am | Avx Corporation | Product Releases | Comments

AVX Corporation has released its new TCN PulseCap Series tantalum solid electrolytic chip capacitors, a polymer electrode version of AVX’s industry-favorite, high capacitance, and high energy TLN PulseCap Series. Available in the same single, large, low-profile case size (EIA 7361-20) as its parent series...

LISTED UNDER: Chips
Advertisement

TVS devices provide overvoltage protection & EMI attenuation over a broad range of frequencies in automotive applications

August 14, 2013 2:10 pm | Avx Corporation | Product Releases | Comments

AVX Corporation has introduced the new TransFeed Automotive Series, which combines the best electrical characteristics of its TransGuard Transient Voltage Suppressors (TVS) and its Feedthru Capacitors in a single chip to provide state-of-the-art overvoltage circuit protection and EMI reduction....

LISTED UNDER: Chips

TVS diode array provides ESD protection for sensitive chipsets

July 31, 2013 2:12 pm | Littelfuse, Inc. | Product Releases | Comments

Littelfuse announced it has developed a new SP3012-06UTG Low Capacitance ESD Protection TVS Diode Array (SPADevices). The new product is optimized for protecting sensitive chipsets on high-speed data lines from any external ESD (electrostatic discharge) event.

LISTED UNDER: Chips

Single-chip system serves IP-based wireline and wireless applications

July 12, 2013 3:01 pm | Semtech Corp. | Product Releases | Comments

Semtech Corporation announced the general availability of the ACS9522T, the latest addition to the ToPSync platform that integrates a revolutionary new synchronization system on a chip (SoC). The ACS9522T breaks new ground in the industry by providing a complete single-chip hardware and software synchronization solution....

LISTED UNDER: Chips

Capacitor designed for military/aero applications

July 2, 2013 2:46 pm | Vishay Intertechnology | Product Releases | Comments

Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new TANTAMOUNT solid tantalum chip capacitor with very low ESR down to 0.180 Ω at 100 kHz. For military, avionics, and aerospace applications, the conformal-coated, surface-mount CWR26 is qualified to MIL-PRF-55365/13.

LISTED UNDER: Chips

Multilayer chip capacitors include a working voltage up to 3kV DC

June 11, 2013 9:30 am | Product Releases | Comments

Syfer Technology has expanded its X8R dielectric range of multilayer chip capacitors (MLCCs). The range has been extended, from a working voltage of 250V DC, up to 3kV DC and will now be available in capacitance values from 270pF to 1.8µF, with tolerances of ±5%, 10% and 20% dependant on C/V value.

LISTED UNDER: Chips
Advertisement

Tantalum chip capacitor series offers a small footprint and low profile

May 30, 2013 1:40 pm | Kemet Electronics Corporation | Product Releases | Comments

KEMET Corporation announced the release of three new series of tantalum chip capacitors: T488 Small Case Substrate Terminal MnO2, T527 Facedown Polymer, and T529 Small Case Substrate Terminal Polymer. These miniaturized solutions offer the highest capacitance values (22uF to 220uF) available today in both a standard 2012 (2.0mm x 1.2mm) and 3216 (3.2mm x 1.6mm) EIA case size....

LISTED UNDER: Chips

RF chip capacitors intended for automotive applications

March 26, 2013 4:30 pm | Avx Corporation | Product Releases | Comments

AVX Corporation has introduced a new series of AEC-Q200-qualified RF chip capacitors for automotive applications.  Available in 0402 and 0603 case sizes, the new C0G (NP0) dielectric Automotive “U” Series capacitors exhibit ultra-low ESR, high Q, and lot-to-lot uniformity....

LISTED UNDER: Chips

Transceiver chipset enables the development of low-power, high-data rate solutions for true mobile devices

February 20, 2013 4:41 pm | Imec Inc. | Product Releases | Comments

Imec, in collaboration with Panasonic Corporation (Japan), has presented at the IEEE International Solid-State Circuits Conference (ISSCC2013) a 60GHz radio transceiver chipset with low power consumption, that delivers high data rates over short distances.

LISTED UNDER: Chips
X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading