Wireless Control Application Kit for Remote Monitoring

July 16, 2007 10:53 am | Product Releases | Comments

Rabbit Semiconductor’s Wireless Control Application Kit provides a development reference to interface a low-cost, license-free 900 MHz or 2.4 GHz wireless data modules from Maxstream to a Rabbit-based embedded system. The Wireless Control Application Kit contains a low power Rabbit LP3500 single board computer SBC, and two MaxStream RF Modules.

LISTED UNDER: Boards & Modules

USB Stack Enhances Middleware

July 16, 2007 8:03 am | Iar Systems Software | Product Releases | Comments

IAR Systems launched a USB stack that works with the IAR PowerPac RTOS and file system to offer the benefits a USB interface to developers using IAR Embedded Workbench for ARM. This addition to the company’s integrated middleware portfolio is particularly suitable for use in portable devices that need a convenient connection to a PC. The IAR PowerPac USB stack is pre-configured and - when programmed using IAR Systems’ build tools, RTOS and file system - includes everything necessary to add a fully-working USB interface to an ARM device.

LISTED UNDER: Boards & Modules

Reference Design Allows Rapid USB Mass Storage Interface Development

July 16, 2007 7:47 am | Product Releases | Comments

Future Technology Devices International Limited (FTDI) announced the availability of the VF2F2 reference design module for its Vinculum VNC1L embedded USB host controller. The design incorporates a practical firmware application that demonstrates file transfer using the USB mass storage class interface. It permits moving files from a USB device to a USB flash disk. The design could also be used to transfer files between other mass storage class devices such as MP3 players or between two USB flash disks. The module is equipped with two USB type A sockets and four control buttons.

LISTED UNDER: Boards & Modules

FlexATX Intel Core 2 Duo Motherboard

July 16, 2007 7:38 am | Product Releases | Comments

Adlink Technology’s M-885 adopts the Mobile Intel 945GM Express chipset and supports the Intel Core2 Duo which is said to improve performance and lowers power consumption up to 40 percent. The motherboard offers a 667 MHz Front Side Bus, supports up to 2 GB dual-channel DDR2 memory, and provides a high resolution (up to 1,600 × 1,200) integrated graphics engine. It adopts the FlexATX form factor for use in a variety of industrial chassis designs and customizations.

LISTED UNDER: Boards & Modules

Sixteen-bit Resolution PCI DAQ Card

July 16, 2007 7:28 am | Product Releases | Comments

Adlink Technology’s PCI-9221 multi-function 16-bit resolution DAQ card features a sampling rate up to 250kS/s. It also provides a programmable I/O supporting digital I/O (TTL), general-purpose timer/counters, motor encoder inputs, and PWM (pulse width modulation) outputs for simple motion control. The PCI-9221 card offers two 16-bit analog outputs which are suitable for applications requiring DC voltage output control.

LISTED UNDER: Boards & Modules

microATX Motherboard Supports Intel Core 2 Duo

July 16, 2007 7:23 am | Product Releases | Comments

Adlink Technology introduced an industrial microATX motherboard supporting the Intel Core 2 Duo processor. The on-board LGA 775 socket supports the higher clock speeds of the processor. The M-946 FSB supports speeds of 533 MHz, 800 MHz and 1,066 MHz. Combined with dual channel DDR2 memory at 533/667 MHz, the motherboard provides the necessary bandwidth for high-speed SMT inspection systems, automation and industrial control applications.

LISTED UNDER: Boards & Modules

All-in-one Memory Family for Embedded Applications

July 12, 2007 10:09 am | Product Releases | Comments

SST is sampling the first in its All-in-OneMemory product family, the SST88VP1107. By blending the features of NOR, NAND and RAM in a unified architecture, this product comes configured with 512 KByte instant-on boot NOR, 128 MB execute-in-place (XIP) code storage, 120 MB data storage and 12 MB system RAM for mobile and embedded applications. The single-bus, single-package product offers a

LISTED UNDER: Boards & Modules

Low Cost I/O Expansion for Embedded Designs

July 11, 2007 6:30 am | Product Releases | Comments

VersaLogic announced a line of low-cost I/O expansion boards called Serial Peripheral eXpansion (SPX ) modules. The SPX format provides designers with an easy-to-implement I/O expansion platform for both standard and custom functions. The format uses a proprietary implementation of the Serial Peripheral Interface (SPI) Bus that operates at high speed on a simple 14-pin interconnect cable. Initial SPX offerings include an 8-Channel Analog Input module, CANbus controller, 4-Channel Analog Output module

LISTED UNDER: Boards & Modules

Coplanar Power Modules

July 3, 2007 6:36 am | Product Releases | Comments

FCI announces its Metral coplanar power modules that can be used in Zone 3 to interface between a front board and rear transition module (RTM) in an ATCA system. Each five-row module provides 10 stamped-and-formed power contacts. Headers use a blade contact structure, and the corresponding receptacle connectors use dual-beam contacts. An individual power blade is rated for 3A nominal continuous current with current applied to all contacts

LISTED UNDER: Boards & Modules

DDR3 Unbuffered DIMMs

July 3, 2007 6:33 am | Product Releases | Comments

SMART Modular Technologies (WWH), Inc. announces its DDR3 unbuffered DIMM product family to address the projected needs of DDR3-enabled high-end desktop systems, supporting DDR3 unbuffered DIMMs ranging from 512 MB to 2 GB. Providing improved system speeds (up to 667 Mhz/1,333 MHz data rate), lower power consumption (1.5V vs. 1.8V for DDR2) and larger memory densities from DDR2

LISTED UNDER: Boards & Modules

EBX SBC for Industrial Applications

July 3, 2007 6:29 am | Product Releases | Comments

WinSystems launches its EBX-compatible Intel 1.8 GHz Pentium M single board computer. The EBC-855-G-1.8-1 is a RoHS-compliant, processor- and I/O-intensive board offering -40°C to +70°C temperature operation. Target applications include a range of industries that include automation, medical/diagnostic equipment, communications, security, test and measurement, and outdoor transaction terminals.

LISTED UNDER: Boards & Modules

Four-Channel Analog I/O

July 3, 2007 6:25 am | Product Releases | Comments

WAGO Corp. introduces two new four-channel analog modules for its WAGO-I/O-System. Designated the 750-553 and the 750-555, these modules transmit analog signals with standard values of 0-20 mA and 4-20 mA, respectively. Both modules are housed in a compact, 12 mm wide DIN rail mount housing, and they are compatible with all other 750/753 series bus-couplers, controllers and I/O modules.

LISTED UNDER: Boards & Modules

VME VXS Backplane for Military Applications

July 3, 2007 6:20 am | Product Releases | Comments

Carlo Gavazzi Computing Solutions announces its VITA 41 VME switched serial (VXS) switch fabric backplane for military and aerospace applications that allows users to integrate a high-performance upgrade to the latest VITA standards while still supporting the legacy capability of the VME64x bus structure. Its retrofit capabilities help achieve fast data transfer rates without

LISTED UNDER: Boards & Modules

VXS Payload Extender Boards

July 3, 2007 6:16 am | Product Releases | Comments

Elma Bustronic announces its VXS Payload Extender Boards that are designed to bring a circuit card completely out of a card cage or enclosure so that it can be tested or debugged, providing access to both sides of the test board. There are test points for all of the lines on each 160-pin connector and the MultiGig P0 connector. The boards come in a 10-layer stripline design for the rigid PCB and microstrip design for the flex circuit portion.

LISTED UNDER: Boards & Modules

Micro Amplifier for Small Footprint Applications

July 3, 2007 6:12 am | Product Releases | Comments

NuWaves Engineering introduces its uHILNA micro amplifier, the uHILNA. With outside dimensions of 1.00¨ x .75¨ x .50¨ and light weight, it is suitable for applications where footprint size is a determining factor. At 1/8 the size and weight

LISTED UNDER: Boards & Modules


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