Molded chip scale package ideal for ultra-portable applications
September 4, 2012 10:25 am | 3M Electronics Solutions Division | Product Releases | CommentsAlpha and Omega Semiconductor Limited introduced the AOC2403 – the industry’s first Molded Chip Scale Package (MCSP) in a tiny 0.97mm x 0.97mm x 0.3mm power package. Compared to existing Chip Scale Package (CSP) solutions,
LISTED UNDER: Boards & Modules
Stop switch ideal for space sensitive applications
August 29, 2012 10:09 am | Product Releases | CommentsMilford, CT – EAO Corporation of Milford, CT USA, a premier global supplier of Human Machine Interface (HMI) Systems and Components, introduces the Series 51 Stop Switch. These units are ideal for space sensitive applications often found within:
LISTED UNDER: Boards & Modules
Module improves interference immunity in serial scan operations
August 27, 2012 9:33 am | Product Releases | CommentsGOEPEL electronic introduces the TAP-Isolator, a special module to improve interference immunity in serial scan operations. The newly developed hardware was specifically designed for applications in critical signal environments needing potential isolation, enabling a complete galvanic insulation of the Test Access Port (TAP) transceiver from the target.
LISTED UNDER: Boards & Modules
Safety modules tout reduced installation complexity
August 24, 2012 12:12 pm | by Pepperl+Fuchs, G10, safety modules, AS-Interface, Safety at Work, IP67 | Product Releases | CommentsPepperl+Fuchs introduced the G10 safety module – said to be the world’s smallest AS-Interface safety module with IP67 protection. These safety modules are positioned as a Safety at Work solution that reduces the complexity and cost of any safety installation. Additionally, the design supports
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Module designed for high-speed interfacing
August 20, 2012 2:40 pm | Product Releases | CommentsWinSystems announced a SUMIT-ISM compatible 96-line digital I/O module designed for high-speed interfacing. Named the PXM-UIO96-2, it offers PCI Express expansion on a 90 x 96mm PC/104-sized module enabled by the stackable high-speed SUMIT connector.
LISTED UNDER: Boards & Modules
Boundary scan I/O module able to process voltages up to 30 V
August 20, 2012 7:41 am | Product Releases | CommentsGOEPEL electronic introduces the SFX5212, another I/O module within the frame of the company’s Boundary Scan hardware platform SCANFLEX. The new SCANFLEX module family member provides independently programmable I/O channels, and is able to process voltages up to 30 V. Additionally, it offers the well-proven VarioCore technology...
LISTED UNDER: Boards & ModulesIntegrated circuit targets cellular, analog applications
August 16, 2012 1:30 pm | Product Releases | CommentsLansdale Semiconductor, Inc. president, R. Dale Lillard, announced recently the availability of the MC13150 a narrowband FM Coiless Detector intermediate frequency (IF) subsystem targeted at cellular and other analog applications. This wireless integrated circuit (IC) was originally designed and built by Freescale Semiconductor, Inc
LISTED UNDER: Boards & Modules
Module designed for high-speed networking connectivity
August 10, 2012 3:08 pm | Product Releases | CommentsWinSystems announced a SUMIT-ISM compatible Gigabit Ethernet module designed for high-speed networking connectivity for small form factor, industrial embedded applications. The PXM-GIGE is a 90 x 96mm module that connects to 10/100/1000 Mbps networks using standard Category 5 (CAT5) unshielded twisted pair (UTP) copper cables.
LISTED UNDER: Boards & Modules
Modules offer two analog outputs
August 10, 2012 3:02 pm | Product Releases | CommentsPepperl+Fuchs introduces three new G11 Series AS-Interface I/O Modules. The first two modules offer two analog outputs each; one for 0-20 mA operation for flat cable connectivity and one for 0-20 mA operation with an M12 round connector.
LISTED UNDER: Boards & Modules
Ultra thin copper-free flexible circuit ideal for medical applications
August 9, 2012 12:02 pm | Product Releases | CommentsDKN Research now carries ultra thin copper-free flexible circuits with reliable via holes. The Haverhill Massachusetts based firm developed a series of processing technologies to generate thin nickel traces on both sides of thin polyimide film specifically targeting those scientific and medical applications that require the elimination of copper metals from electronic devices. It also provides a wider range of design flexibilities for packaging and termination in special electronic circuits. DKN Research continually develops a wide range of packaging technologies for flexible & printable electronics.
LISTED UNDER: Boards & Modules
Computer on module includes dual core 32-nm Atom processor, NM10 Express chipset for ETX-based systems
August 9, 2012 11:26 am | Product Releases | CommentsADLINK Technology announced the ETX-CV Computer on Module (COM) family. Based on the latest dual-core 32nm process Intel Atom Processor and NM10 Express Chipset. Power consumption ranges between 6 W and 12 W. The ETX-CV is positioned as an entry level ETX module for
LISTED UNDER: Boards & Modules | Computer Peripherals & Networking Devices
Development platform accommodates 3U cPCI conduction-cooled modules
August 9, 2012 11:06 am | Product Releases | CommentsExtreme Engineering Solutions, Inc. (X-ES) is shipping the XPand1201, a 3U CompactPCI development platform for conduction-cooled modules. This platform supports up to eight 3U CompactPCI modules and two optional power supply modules. With support for rear transition modules (RTMs), the platform provides
LISTED UNDER: Boards & Modules | Computer Peripherals & Networking Devices
PC/104-size Gigabit Ethernet module includes SUMIT PCIe for high speed networking
August 9, 2012 10:49 am | Product Releases | CommentsWinSystems announced a SUMIT-ISM compatible Gigabit Ethernet module designed for high-speed networking connectivity for small form factor, industrial embedded applications. The PXM-GIGE is a 90 mm x 96 mm module that connects to 10/100/1000 Mbps networks using standard Category 5 (CAT5)
LISTED UNDER: Boards & Modules | Computer Peripherals & Networking Devices
Ultracapacitor modules are ideal for power conditioning, voltage sag compensation
August 7, 2012 3:38 pm | Product Releases | CommentsIoxus, Inc.announced it is offering thin cell ultracapacitor module designs worldwide for power conditioning and automated guided vehicle (AGV) applications. Ioxus THiNCAP™ iMOD™ modules consist of high power, thin, flexible ultracapacitor packs, instead of cylindrical cells, making them ideal for a variety of applications where small form factor is valued. The THiNCAP iMOD modules save space and weight, benefiting users with a reduced total cost of ownership as compared to batteries with longer life, higher cycle count, wider operational temperature range and reduced maintenance requiremen
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Small OEM driver board controls liquid crystal devices
August 1, 2012 10:58 am | Product Releases | CommentsMosaic has added a new member to its family of embedded plug-in I/O modules called Wildcards. The LCVR Wildcard is a liquid crystal controller, compatible with all Liquid Crystal Variable Retarders (LCVRs) and appropriate for driving most other nematic liquid crystal devices. It is said to
LISTED UNDER: Boards & Modules | Optoelectronics & Displays