1020 MHz SMT phase-locked oscillator features exceptionally low phase noise

September 5, 2012 4:06 pm | Product Releases | Comments

The CLX-1020-XA Phase-Locked Oscillator from EM Research operates at 1020 MHz and features exceptionally-low phase noise (<-109 dBc/Hz @ 10 KHz).  The unit is locked to an internal reference and offers +7 dBm output power with low power consumption (+5 VDC @ <65 mA) and low spurs (<-80 dBc).

LISTED UNDER: Boards & Modules | RF & Microwave/Communications

Integrated light engine modules produce up to 104 lumens per watt

September 4, 2012 2:14 pm | Product Releases | Comments

Thomas Research Products is pleased to announce that their LED Core series of integrated light engine modules have exceeded 100 lumens per watt. The TR-SS1 series LED Core Garage Modules feature Type V DLC Compliant optics.

LISTED UNDER: Boards & Modules

Compact GPS module achieves 22 mA current consumption

September 4, 2012 1:46 pm | Product Releases | Comments

MSC now offers the L70, a particularly high-performance and at the same time ultra low power consumption GPS module, from Quectel. The L70 module comes in a compact 10.1 mm x 9.7 mm x 2.5 mm form factor. The L70 module is based on the MTK MT3339 chipset and has 66 acquisition channels and 22 tracking channels that, in combination with advanced AGPS technology called EASY (Embedded Assist System), provide the highest performance.    

LISTED UNDER: Boards & Modules

Molded chip scale package ideal for ultra-portable applications

September 4, 2012 10:25 am | 3M Electronics Solutions Division | Product Releases | Comments

Alpha and Omega Semiconductor Limited introduced the AOC2403 – the industry’s first Molded Chip Scale Package (MCSP) in a tiny 0.97mm x 0.97mm x 0.3mm power package. Compared to existing Chip Scale Package (CSP) solutions,

LISTED UNDER: Boards & Modules

Stop switch ideal for space sensitive applications

August 29, 2012 10:09 am | Product Releases | Comments

Milford, CT – EAO Corporation of Milford, CT USA, a premier global supplier of Human Machine Interface (HMI) Systems and Components, introduces the Series 51 Stop Switch.  These units are ideal for space sensitive applications often found within:

LISTED UNDER: Boards & Modules

Module improves interference immunity in serial scan operations

August 27, 2012 9:33 am | Product Releases | Comments

GOEPEL electronic introduces the TAP-Isolator, a special module to improve interference immunity in serial scan operations. The newly developed hardware was specifically designed for applications in critical signal environments needing potential isolation, enabling a complete galvanic insulation of the Test Access Port (TAP) transceiver from the target.

LISTED UNDER: Boards & Modules

Safety modules tout reduced installation complexity

August 24, 2012 12:12 pm | by Pepperl+Fuchs, G10, safety modules, AS-Interface, Safety at Work, IP67 | Product Releases | Comments

Pepperl+Fuchs introduced the G10 safety module – said to be the world’s smallest AS-Interface safety module with IP67 protection. These safety modules are positioned as a Safety at Work solution that reduces the complexity and cost of any safety installation. Additionally, the design supports

LISTED UNDER: Boards & Modules

Module designed for high-speed interfacing

August 20, 2012 2:40 pm | Product Releases | Comments

WinSystems announced a SUMIT-ISM compatible 96-line digital I/O module designed for high-speed interfacing.  Named the PXM-UIO96-2, it offers PCI Express expansion on a 90 x 96mm PC/104-sized module enabled by the stackable high-speed SUMIT connector.

LISTED UNDER: Boards & Modules

Boundary scan I/O module able to process voltages up to 30 V

August 20, 2012 7:41 am | Product Releases | Comments

GOEPEL electronic introduces the SFX5212, another I/O module within the frame of the company’s Boundary Scan hardware platform SCANFLEX. The new SCANFLEX module family member provides independently programmable I/O channels, and is able to process voltages up to 30 V. Additionally, it offers the  well-proven VarioCore technology...

LISTED UNDER: Boards & Modules

Integrated circuit targets cellular, analog applications

August 16, 2012 1:30 pm | Product Releases | Comments

Lansdale Semiconductor, Inc. president, R. Dale Lillard, announced recently the availability of the MC13150 a narrowband FM Coiless Detector intermediate frequency (IF) subsystem targeted at cellular and other analog applications.  This wireless integrated circuit (IC) was originally designed and built by Freescale Semiconductor, Inc

LISTED UNDER: Boards & Modules

Module designed for high-speed networking connectivity

August 10, 2012 3:08 pm | Product Releases | Comments

WinSystems announced a SUMIT-ISM compatible Gigabit Ethernet module designed for high-speed networking connectivity for small form factor, industrial embedded applications.  The PXM-GIGE is a 90 x 96mm module that connects to 10/100/1000 Mbps networks using standard Category 5 (CAT5) unshielded twisted pair (UTP) copper cables.

LISTED UNDER: Boards & Modules

Modules offer two analog outputs

August 10, 2012 3:02 pm | Product Releases | Comments

 Pepperl+Fuchs introduces three new G11 Series AS-Interface I/O Modules. The first two modules offer two analog outputs each; one for 0-20 mA operation for flat cable connectivity and one for 0-20 mA operation with an M12 round connector.

LISTED UNDER: Boards & Modules

Ultra thin copper-free flexible circuit ideal for medical applications

August 9, 2012 12:02 pm | Product Releases | Comments

DKN Research now carries ultra thin copper-free flexible circuits with reliable via holes. The Haverhill Massachusetts based firm developed a series of processing technologies to generate thin nickel traces on both sides of thin polyimide film specifically targeting those scientific and medical applications that require the elimination of copper metals from electronic devices. It also provides a wider range of design flexibilities for packaging and termination in special electronic circuits. DKN Research continually develops a wide range of packaging technologies for flexible & printable electronics.

LISTED UNDER: Boards & Modules

Computer on module includes dual core 32-nm Atom processor, NM10 Express chipset for ETX-based systems

August 9, 2012 11:26 am | Product Releases | Comments

ADLINK Technology announced the ETX-CV Computer on Module (COM) family. Based on the latest dual-core 32nm process Intel Atom Processor and NM10 Express Chipset.  Power consumption ranges between 6 W and 12 W. The ETX-CV is positioned as an entry level ETX module for

LISTED UNDER: Boards & Modules | Computer Peripherals & Networking Devices

Development platform accommodates 3U cPCI conduction-cooled modules

August 9, 2012 11:06 am | Product Releases | Comments

Extreme Engineering Solutions, Inc. (X-ES) is shipping the XPand1201, a 3U CompactPCI development platform for conduction-cooled modules. This platform supports up to eight 3U CompactPCI modules and two optional power supply modules. With support for rear transition modules (RTMs), the platform provides

LISTED UNDER: Boards & Modules | Computer Peripherals & Networking Devices


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