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Terminals

Eureka SDC-1000 Ultra Low Humidity Dry Cabinet

March 23, 2015 3:23 am | Eureka Dry Tech | Products

Model: SDC-1000 Fast Super Dryer Capacity: 657 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% RH within 30 minutes after accessing door for 30 seconds or less. External Dimension: 60*193*76 cm (W*H*D) Internal Dimension: 56*174*61 cm (W*H*D) Door Type: Anti-Static Glass Hygrometer: German Digital TESTO Thermal Hygrometer Power Consumption: 100 Watts Lock Type: Standard Anti-static Glass, Anti-static Paint on Body and Shelves, ​Anti-static Caster / Stands, 1 M Ω Ground Wire

LISTED UNDER: Microcomputer | Terminal | Printed Circuit

Eureka XDC-2000 Ultra Low Humidity Dry Cabinet

March 23, 2015 3:12 am | Eureka Dry Tech | Products

Model: XDC-2000 Fast Super Dryer Capacity: 1314 Liters Humidity Range: LESS THAN 5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after accessing door for 30 seconds or less. External Dimension: 120*193.5*76 cm (W*H*D) Internal Dimension: 110*174*61 cm (W*H*D) Door Type: Anti-Static Glass Hygrometer: German Digital TESTO Thermal Hygrometer Power Consumption: 150 Watts Lock Type: Standard Anti-static Glass, Anti-static Paint on Body and Shelves, ​Anti-static Caster / Stands, 1 M Ω Ground Wire

LISTED UNDER: Microcomputer | Terminal | Circuit Design Aids

PCB test system designed for aircraft, transportation, and manufacturing industries

March 26, 2013 3:33 pm | Saelig Company, Inc. | Product Releases | Comments

Saelig Company has introduced the System 8 Diagnostic Solution Plus - a unique, versatile, easy-to-use PCB test system that uses a selection of CD-drive-size modules to create a PC-driven PCB test station. The System 8 Diagnostic Solution Plus, which can be built in a PC case or 19" rack-mounted...

LISTED UNDER: Printed Circuit | Boards
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Holt Integrated Circuits announces validation of world’s smallest MIL-STD-1553 remote terminal

March 15, 2013 11:07 am | Holt Integrated Circuits | Product Releases | Comments

Holt Integrated Circuits announced formal MIL-STD-1553 RT validation of HI-6130/31, the world’s smallest BC/MT/ RT multi-terminal solution. Validation was performed at Test Systems, Inc., an independent Air Force approved testing service for MIL-STD-1553 remote terminals.

LISTED UNDER: Miniature & Subminiature

Wi-Fi module designed for easy and fast serial-to-Wi-Fi connectivity

February 21, 2013 1:20 pm | Lantronix | Product Releases | Comments

Lantronix announced the launch of its new xPico Wi-Fi module, a compact, embedded wireless device server designed for easy and fast serial-to-Wi-Fi connectivity. Lantronix will be showcasing a live demo of the xPico Wi-Fi device during Embedded World 2013 at the Nuremberg Exhibition Centre, Hall 1 - Booth I-309, from February 26 - 28, 2013.

LISTED UNDER: Miniature & Subminiature | RF

5GHz WiFi module designed for 802.11ac notebook and mobile equipment applications

January 14, 2013 9:23 am | Rfmd | Product Releases | Comments

RF Micro Devices introduced the highly-integrated RFFM4501E front end module (FEM) for 802.11ac notebook and mobile equipment applications. RFMD’s newest WiFi FEM meets or exceeds the system requirements for 802.11ac connectivity in the 5.150GHz – 5.850GHz frequency band and is optimized to support multiple applications....

LISTED UNDER: Quick Disconnect

OCXO operates at a frequency of 10MHz

December 17, 2012 11:02 am | Product Releases | Comments

IQD’s new IQOV-70 series OCXO which is launching at Embedded World 2013 is designed for use in next generation multimode base station platforms. Operating at a frequency of 10MHz, the new model achieves a frequency stability of ±3ppb (parts per billion) over the operating temperature range of -10 to +70 degrees C.

LISTED UNDER: Miniature & Subminiature

Thin-film thrmoelectric modules offer low-profile thermal solutions

December 10, 2012 3:33 pm | Nextreme Thermal Solutions | Product Releases | Comments

Nextreme Thermal Solutions announced a new series of thin-film thermoelectric modules that offer higher cooling capacity, robust mechanical design and source-matched heat flux density for easier integration into existing electronic systems. At only 1.1mm high,

LISTED UNDER: Insulated
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