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Home > Thermal interface material exhibits thermal conductivity of 1.10 W/m°K

Thermal interface material exhibits thermal conductivity of 1.10 W/m°K

 Sarcon 30QR from Fujipoly is a low hardness thermal interface material that exhibits a thermal conductivity of 1.10 W/m°K and a thermal resistance of .57 °Cin2/W.

This material is available in roll or sheet form and can easily be die-cut, molded or extruded to accommodate your unique application specifications.

The versatility of Sarcon 30QR is evident in its use a conductive insulator for semiconductors, compression joining material for thermistors & temperature sensors, as well as a gap filler material for all types of heaters. This is V-0 flame-retardant thin film is recommended for applications with operational temperatures that range from -60°C to +180°C.

Fujipoly
(732) 969-0100
www.fujipoly.com [1]


Source URL (retrieved on 06/19/2013 - 11:46pm): http://www.ecnmag.com/products/2012/09/thermal-interface-material-exhibits-thermal-conductivity-110-w/m%C2%B0k

Links:
[1] http://www.fujipoly.com