Clamping Devices Improve Power Transistor Performance
The TO270WB  and TO270WBL  Clamping Devices enhance the connection between a plastic-packaged RF Power Transistor and the ground plate of an RF amplifier. Often these high-power plastic-packaged devices are just bolted down. The new clamps improve both the electrical ground and the thermal ground; thus increasing P1dB, decreasing IMD3, while improving thermal performance and reliability (please see this important Application Note ). Datasheets and samples are exclusively available at Richardson Electronics, 1-800-737-6937 (North America), or www.rell.com/locations  (International).