Silicon Via Technology Enhances System Integration
Addressing 3D integration of CMOS ICs into devices such as photo sensors, gas sensors, power devices, or MEMS components, the Through Silicon Via (TSV) technology from austriamicrosystems two eight-inch wafers can be electrically connected, with typical TSV depths of 200 µm to 300 µm. A proprietary back side re-distribution layer concept enables various front and back side IO pad connections. The TSV technology works with any 0.35-µm analog specialty technologies such as CMOS, HV-CMOS, SiGe BiCMOS, or embedded Non-Volatile Memory.
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