Modular Mezzanine Connector Eases Board Assembly
Addressing connection issues between parallel PC boards, the IT3 Series Mezzanine Connector from Hirose is a three-piece modular system that eases assembly, aids X-ray inspection, and improves reflow performance. The system includes two low-profile BGA board-mounted receptacles with a variable-height interposer that reduces risk of mechanical damage to the BGA joints. The BGA solder balls are available in standard eutectic tin-lead or lead-free, and the connectors are qualified to EIA-364-1000 for environmental performance and IPC-9701 for long-term solder joint reliability.
408-253-9640, www.hirose.com