Interconnect Offers Obsolescence Solutions
Enabling footprint conversion adapters and offering obsolescence solutions, Interconnect Systems' FlexFrame, is a system of interconnects that offers flexible in configuration options including pin location and pitch, various standoff heights, and windows in the carrier that allow components to be placed in the center of the interconnect on the bottom of the adapter. The device consists of PhosBronze pins which are loaded into a FR4 carrier and bent to shape to emulate the gullwing or j-leads on the IC package. The connector is soldered between the adapter and host PCB to create a rugged interconnect.
Interconnect Systems, Inc.
805-482-2870, www.isipkg.com