Interconnect Family Features Contacts to Reduce Broadside Coupling and Crosstalk
Samtec expanded its Board-to-Board and Cable-to-Board line featuring a rugged Edge Rate contact. These systems are designed for applications where signal integrity and durability are critical. The specially designed contacts are asserted to offer impedance matching, reduced broadside coupling and crosstalk, and high cycle life. Board level systems include the 0.8 mm (.0315”) pitch Edge Rate interconnect strip system (ERM8/ERF8 Series) and the high speed RiseUp MicroCard stacking system (RU8 Series). SEARAY open pin field arrays (SEAM/SEAF Series) and DP array differential pair arrays (DPAM/DPAF Series) offer high density solutions with maximum grounding and routing flexibility. Cable-to-Board systems include the signal integrity optimized 0.8 mm (.0315”) pitch, 50 Ohm micro coax Edge Rate strip (ERCDA Series) and 100 Ohm Twinax data bank high speed/high density systems (GCCA/GCAM Series), as well as the 100 Ohm Twinax MicroCard assembly (EEDP Series). Pricing begins at .08/line in production volume.
800-972-6832, www.samtec.com