ZIF Socket for 0.5 mm Pitch BGA
Ironwood Electronics introduced its model CG-BGA-5000 high performance BGA ZIF socket for 0.5 mm pitch BGA. It is designed for a 6 mm package size, and it operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. The sockets dissipate up to several Watts without extra heat sinking, and they can handle up to 100W with a custom heat sink. The contact resistance is typically 23 m? per pin. The socket is made with high performance and low inductance elastomer, and the temperature range is -35°C to +85°C. The pin inductance is 10.15 nH, and the capacitance to ground is 0.10 pF. The socket accommodates 6 mm BGA body size IC packages with 11 × 11 array and 121 balls.
800-404–0204, www.ironwoodelectronics.com