Endicott Interconnect (EI) Technologies announced high-volume, fully assembled PC boards. These high-density hybrid PCB assemblies are double-sided complex boards with mixed technologies and an average component count of >1,500 in large sizes (18"×24") for SMT or non-SMT backplanes. Assembly technologies include SMT, press fit, wave solder, selective PTH solder, and hand assembly and solder. Components that can be placed on-board include high I/O area array modules (BGA/CGA down to 0.03" pitch and PBGA), fine pitch leaded parts to 12 mils and SMT discretes and chips down to 0402 size as well as high-density, high-I/O connectors. Complete mechanicals (cage, chassis, system assemblies) can be provided.
Endicott Interconnect Technologies,Inc., 607-755-1847, www.eitny.com