High-Density PC Board Assemblies
Endicott Interconnect (EI) Technologies, Inc. introduced large, high complexity PC boards for use in compute-intensive applications such as servers and mainframes for defense, aerospace and commercial uses. High-density, double sided, hybrid PC board assemblies (SMT/PTH/press fit) are available with an average component count of > 1,500, including high-I/O area array modules (CGA, LGA, PBGA) and dense, high-I/O connectors in sizes up to 32" × 44". They provide the capability of going from bare board to a complex PC board assembly that is finished, populated and fully tested. A range of PC board assemblies is available from high-end, complex, mission critical to lower complexity, depending on customer requirements.
Endicott Interconnect Technologies, Inc., 607-755-1847, www.eitny.com