MicroTCA Backplane Focuses on Modules and Cooling
Elma Electronic Inc. introduced the MicroBox 1U MicroTCA backplane device. The device has up to 10 modules and is 45 mm × 465 mm × 210 mm . Its module bays accept single or double modules and full, mid-, and compact sizes. Cooling is also a critical element in MicroTCA solutions. The side-to-side cooling configuration of the MicroBox does not have any bends in the airflow path. A typical MicroTCA subrack chassis may use up to 3U of vertical space for fan trays, but the MicroBox can cool its chassis using 1U height. It dissipates 35 W per module and has eight fans providing 20 CFM each at 1.5" of water. MicroBox also includes features a 384 W power supply, J-TAG switch module from MicroBlade, and a MicroTCA carrier hub although it accepts any standard modules. Additionally there is a testing and diagnostics module that provides a remote connection for programming FPGAs, loading test vectors, and upgrading software. Lead time is 4 to 6 weeks.
510-656-3400, www.elma.com