The adapter tops have landing pads that can be designed to accept any device on any pitch and easily settle into fine pitch footprints, including Thin-Shrink Small Outline Packages (TSSOP) and Quad Flat Packages (QFP) with pitches down to 0.4 mm. In addition, the adapter bottom has raised connection pads up to 0.01 in. (0.25 mm) that provide easy mounting of the adapter to the target board.
Due to the open space now available on the top of the adapter board, manufacturers can easily add components to the design at a minimal cost. Fine Pitch Bump Adapters save users money by integrating higher pitch BGA devices with boards laid out with smaller pitches that typically could not be used together.