Photos of the Day: Embedded Tech Trends wrapup
Embedded Tech Trends (ETT) took place in Phoenix on January 20 and 21. While a large portion of ETT consisted of talks from the vendors, a couple of the companies brought their products to show the editors in attendance:
MEN Micro: Rugged COM Express-based modules
Men Micro was at Embedded Tech Trends to talk about the new VITA 59 standard and how it was adopted for COM Express so it may be used in harsh environments needing higher protection against heat, shock/vibration, and EMC than what was covered by the earlier PICMG standard COM.0. Michael Plannerer, head of Development at MEN Mikro Elektronik noted some of COM Express’ benefits such as the high distribution, and its use with many CPU types, interfaces, connectors, and form factors. It is also considered very up to date, so the newer parameters provide both reliability and the familiarity of a widespread, proven standard supported by a high number of suppliers.
Plannerer provided examples of harsh railway applications – a rail driver desk and a locomotive control system – and a mining machine, which all employ Rugged COM Express-based modules along with popular processors. According to the company, “Rugged COM Express adds PCB wings for mounting the electronics inside a conduction-cooled aluminum (CCA) frame. When combined with passive cooling, the CCA technology enables electronic s to work in high temperature ranges without the need for high-maintenance fans.”
The sturdy metal frame and firmly secured electronics inside this conduction cooled aluminum (CCA) frame deliver high resistance against shock and vibration.
Pentek’s Flexor FMC product family
Pentek demonstrated the first products from its Flexor line. The Model 5973 of FMC carriers featuring a Virtex-7 FPGA, high pin-count VITA 57.1 FMC site, 4 GB of DDR3 SDRAM, PCI Express (Gen. 1, 2 and 3) interface up to x8, optional user-configurable gigabit serial I/O and optional LVDS connections to the FPGA for custom I/O. The device incorporate the emerging VITA 66.4 standard for half size MT optical interconnect, providing 12 optical duplex lanes to the backplane. The new Model 3312 high speed data converter FMC module is displayed above the carrier. It features four 250 MHz 16-bit A/Ds and two 800 MHz 16-bit D/As.
Acq Inducom’s “Medusa” SBC with 12-core processor
Acq Inducom showed off its “Medusa” VPX3424 -- a 3U OpenVPX (VITA 65) Single Board Computer (SBC) featuring the T4240 QorIQ processor from Freescale. This 12-core, 24-thread processor offers 173 GFlops. Built-in AltiVec technology accelerates many common algorithms like FFTs, image analysis, networking or wireless protocols. According to Michel Veldkamp and Andre Somberg of Acq Inducom, the SBC was named Medusa because of the 12 cores on the T4240 processor.
Additional features of the VPX3424 include up to 12GB 3-channel ECC DDR3 RAM, up to 64GB of storage and a range of fast interconnects directly to the backplane, such as PCI Express, Serial RapidIO, 10 Gbit and 1Gbit Ethernet, SATA and USB. It is compatible with most slot profiles and supports VITA 46.11; conduction-cooled and ruggedized REDI variants (VITA 48) are available.
Acq Inducom’s “Medusa” VPX3424 OpenVPX SBC features Freescale’s new T4240 QorIQ processor with 12 cores.