Omron Industrial Automation announces the Safety Certification for 3G3MX2 AC Drives, open loop control drives with built-in safety inputs and external device monitoring output...
Phihong, a global leader in power solutions, has developed a 5-V folding blade adapter that, with a mere 15-mm thickness when the blades are folded, is the thinnest available.
Steinmeyer Inc. has added a 28 mm diameter screw with 12 mm pitch to its extensive line of precision ball screws. This new 28-mm diameter product was designed as a size compatible with the JIS standard.
At the recent Semicon exhibition in San Francisco Suss assembled a group of partners and technical and market experts (shown below) to discuss the status of 3D IC and specifically temporary bonding and thin wafer handling.
Pittman brand 22-mm brush-commutated DC gearmotors integrate planetary gearboxes to meet demanding speed and torque requirements in applications with tight design envelopes.
The load board helps confirm the chassis meets the VITA 46/48 power specifications for VPX and aids in locating hot spots within the enclosure.
ITT Interconnect Solutions, a leading global manufacturer and supplier of connectors, interconnects, and cable assemblies, offers a comprehensive range of zero insertion force (ZIF) connectors for medical diagnostic and imaging equipment.
Fujifilm Dimatix products featured in 36 OEM printers ? 28 of which use new Spectra® Polaris Q-Class printheads. Asian launch of Fujifilm Dimatix DMP-3000 Material Printer and new D-Class printheads for materials deposition applications was enthusiastically received.
Aries Electronics, an international manufacturer of standard, programmed, and custom interconnection products, has expanded its line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down to 0.4 mm.
Heyco Products Inc., a leading ISO 9001:2000 U.S.-based designer and manufacturer of wire protection products and electronic components, offers a wide variety of hole plugs for round, oval, rectangular, square, and “Double D” holes in any color needed.
What is claimed to be the largest research project in Europe to research and develop highly integrated electronic system-in-package (SiP) solutions has been announced by Infineon Technologies.
Fujipoly has added Sarcon 100GR-HL to its line of specially formulated thermal interface materials. This advanced gap filler pad is manufactured with a hardened top surface.
Fully compliant to the CFast standard, 3M Headers for CFast meet the CFA CFast Specification Rev 1.0 and offer many features and options for PCB designers seeking to implement CFast technology.
There are 3 display locations on the large, easy-to-read LCD that displays the temperatures and differences of the two inputs, as well as the specific function when in use.
Yingzhong Gu, a graduate student in the Department of Electrical and Computer Engineering at Texas A&M University, won the third prize in the Graduate Student Poster Contest at the 2010 Institute of Electrical and Electronics Engineers (IEEE) Power and Energy Society (PES) General...