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Mounting Space Reduced by 70%! Development of Multi-Channel Power Management Module Made Smaller with our In-house Internal Mounting Technology

Tue, 09/25/2012 - 8:34pm
Murata Manufacturing

September 26, 2012

Murata Manufacturing Co., Ltd.
President/Statutory Representative Director: Tsuneo Murata

Mounting Space Reduced by 70%! Development of Multi-Channel Power Management Module Made Smaller with our In-house Internal Mounting Technology

Overview

Murata Manufacturing Co., Ltd. has developed a compact compound power management module incorporating multiple power inductors*1, a large-capacity condenser and a power management IC within a single module. The use of our in-house internal mounting technology has enabled us to reduce the footprint of this module by 70% over regular discrete modules.

This product will be placed on exhibit during CEATEC JAPAN 2012 held at Makuhari Messe, Chiba Prefecture, between October 2 and 6, 2012.

Background and Details

Smartphones and other types of cell phone contain a wide range of functions, including call functions, Bluetooth®/Wi-Fi and other wireless communications functions, 1-Seg terrestrial digital broadcasting functions, GPS functions and video play-back functions. All of these functions require a power supply, and by making sure that the required amount of power is directed to where it is needed when it is needed extends the life of the battery. Multi-channel power management modules are the components that control the power supply to enable this.

The market for smartphones is growing rapidly, and the increase in the number of electrical components that need to be mounted in order to keep pace with high levels of functionality is resulting in further demand for high-density components that require less space so that high-capacity batteries can be installed. In order to meet these market requirements, Murata Manufacturing has combined our in-house internal mounting technology and ceramic multi-layer technology (LTCC*2 boards) to establish circuit board technology that enables high-density mounting, resulting in the development of ultra-compact power modules. Mass-production using this technology was commenced in March of this year, and we are currently manufacturing between 5 million and 7 million units per month.

Features

  • Built-in metal alloy power inductor (manufactured by Toko Inc. ) and multi-layer chip inductor.
  • Superior levels of heat dissipation with the use of LTCC in the core board and Cu in the I/O terminals.

Applications

Aimed at cell phones, smartphones, portable media players, digital cameras and other portable appliances.

Module Configuration

Module Configuration

External Size

8.6 (typ) x 10.2 (typ) x 1.84 (typ) mm

Production

Mass-production scheduled to commence at the Komatsu Murata Manufacturing Co., Ltd. from October 2012.

Sample Price

2,000 yen per unit

Terminology

*1 Power inductor: A coil controlling noise and performing rectification and filtering processes on power supply and other power-related circuits.
*2 LTCC
(Low Temperature Co-fired Ceramics) :
Electronic ceramics are usually fired at temperatures of 1,500°C or higher, but LTCC boards are fired at a low 1,000°C or lower to enable silver and copper, which have low conductive resistance, to be used on the internal layer wiring.
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