Advertisement
News
Advertisement

Increased Production of Communications Modules employing Component Embedding Technology

Tue, 02/28/2012 - 4:22pm

Increased Production of Communications Modules

employing Component Embedding Technology

February 29, 2012

Murata Manufacturing Co., Ltd.

President/ Statutory Representative Director: Tsuneo Murata

Increased Production of Communications Modules employing Component Embedding Technology

Overview

Murata Manufacturing Co., Ltd. will increase production of communications modules employing component embedding technology from March 2012.

Background and Details

The smartphone market is rapidly expanding, propelled by the surge in mobile Internet usage. It is necessary to reduce the space required for the fitting of electronic components in smartphones in order to ensure space for high-capacity batteries.

To enable us to respond to market demands for high-density layouts and small-outline components, Murata has developed a technology enabling high-density integration in an ultra-small package through the combination of component embedding technology and multilayer process technology (thin-layer LTCC * substrates) . Mass production of a smartphone power module employing this technology commenced in October 2011, and the total number shipped has now exceeded 500,000.

In addition, to enable us to accommodate the projected future expansion in demand for embedded modules, we intend to increase production from March 2012, in order to supply close-proximity wireless modules (Wi-Fi modules) and RF modules.

Features

  • 10 layers can be formed on thin-layer LTCC substrates at a thickness of 200µm, presenting advantages for wiring efficiency, and enabling the realization of a low profile in the modules.
  • Employs Murata's substrate-embedded monolithic ceramic capacitors
  • Embedding of IC and peripheral SMD components reduces mounting area by 1/4 to 1/2.

Applications

Smartphones and other mobile devices

Part Number

LBEH5DKVMC

External Size

8.7mm (typ.) x 5.1mm (typ.) x 1.35mm (max.)

Production

Production is scheduled to be increased from March 2012 at Komatsu Murata Manufacturing Co., Ltd. (3-5 million units/month)

Terminology

* LTCC

(Low Temperature

Co-fired Ceramics) :

Normal electronic ceramics are fired at high temperatures (1,500°C and higher) . LTCC are fired at low temperatures (1,000°C or lower) , making it possible to employ silver or copper, which display low conductor resistance, for the internal wiring layers.
NOTE

This is a PDF file. is required to view, print, or download this file.

This document file is in RSS (XML) format. An "RSS reader" is required to read this file.

SOURCE

Advertisement

Share this Story

X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading