Increased Production of Communications Modules employing Component Embedding Technology
Increased Production of Communications Modules
employing Component Embedding Technology
Murata Manufacturing Co., Ltd.
President/ Statutory Representative Director: Tsuneo Murata
Murata Manufacturing Co., Ltd. will increase production of communications modules employing component embedding technology from March 2012.
Background and Details
The smartphone market is rapidly expanding, propelled by the surge in mobile Internet usage. It is necessary to reduce the space required for the fitting of electronic components in smartphones in order to ensure space for high-capacity batteries.
To enable us to respond to market demands for high-density layouts and small-outline components, Murata has developed a technology enabling high-density integration in an ultra-small package through the combination of component embedding technology and multilayer process technology (thin-layer LTCC * substrates) . Mass production of a smartphone power module employing this technology commenced in October 2011, and the total number shipped has now exceeded 500,000.
In addition, to enable us to accommodate the projected future expansion in demand for embedded modules, we intend to increase production from March 2012, in order to supply close-proximity wireless modules (Wi-Fi modules) and RF modules.
- 10 layers can be formed on thin-layer LTCC substrates at a thickness of 200µm, presenting advantages for wiring efficiency, and enabling the realization of a low profile in the modules.
- Employs Murata's substrate-embedded monolithic ceramic capacitors
- Embedding of IC and peripheral SMD components reduces mounting area by 1/4 to 1/2.
Smartphones and other mobile devices
8.7mm (typ.) x 5.1mm (typ.) x 1.35mm (max.)
Production is scheduled to be increased from March 2012 at Komatsu Murata Manufacturing Co., Ltd. (3-5 million units/month)
Co-fired Ceramics) :
|Normal electronic ceramics are fired at high temperatures (1,500°C and higher) . LTCC are fired at low temperatures (1,000°C or lower) , making it possible to employ silver or copper, which display low conductor resistance, for the internal wiring layers.|
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