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Next-gen Fully Automatic Heavy Wire Bonder Will Demo at APEC 2012

Fri, 01/06/2012 - 6:49am
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will demo its next generation BONDJET BJ93X Heavy Wire Bonder at APEC 2012 (http://www.apec-conf.org/) taking place on February 6-9, 2012 in Orlando, FL.

The BONDJET BJ93x Heavy Wire Bonders feature a heavy wire bond head with integrated pull test and large table travel (305 mm x 410 mm) that meets automotive electronics and power semiconductor requirements. "The BONDJET BJ93x Heavy Wire Bonders provide the large current carrying capacity and high reliability that power electronics manufacturers demand," states Joseph S. Bubel, president of Hesse & Knipps, Inc. "They are also the fastest heavy wire bonders available today."

The BONDJET BJ920 handles aluminum, gold and copper heavy round wire and ribbon wire at speeds of 3wires/sec. Patented PiQC Process Integrated Quality Control analyzes 5 critical measurements of bond quality in real time for every bond, ensuring that only reliable, high quality devices are produced.

APEC attendees can learn more about BONDJET BJ93x Heavy Wire Bonder capabilities at Hesse & Knipps booth – number 914.

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