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HiWave Demonstrates Latest Technology at CES

Wed, 01/04/2012 - 3:54am
HiWave Technologies plc will use CES 2012 to demonstrate a range of new components and reference designs to prospective customers in the consumer electronics industry. CES runs from 10th to 13th of January in Las Vegas, and HiWave has its demonstration room in the Venetian Palazzo Hospitality Suites. Components and technologies demonstrated will include the companys new BMR (Balanced Mode Radiator) flat panel speaker drivers, and its Audium amplifier chip, now delivering higher levels of audio power output. These components will be shown in reference designs including Bluetooth and other wireless formats, and iPod docks. HiWave will also be demonstrating its latest advances in Bending Wave Haptics to manufacturers of touch interface devices.

Immediately following CES, HiWave will have a display booth at The International Loudspeaker Association Winter Symposium at the Riviera Hotel in Las Vegas on 13th and 14th January. ALMA has entitled the symposium "The Future of Loudspeakers" and HiWave will be showing the key benefits of its low-cost full-range wide-dispersion BMR speaker drivers coupled with its power-saving battery life-enhancing Audium amplifier chips.

Companies wishing to meet HiWave at either of these events should contact HiWave at sales@hiwave.com. Visit HiWave at  www.hiwave.com.

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