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Enpirion Announces Manufacturing Partnership Agreement for Silicon Magnetics

Tue, 01/03/2012 - 5:27am
Posted by Chris Warner
Enpirion, Inc. is announcing that it has entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. -- JCAP -- for the manufacturing of silicon-based magnetics utilizing Enpirions proprietary MEMS (Micro-electronic Magnetic Silicon) technology. Earlier in 2011, Enpirion demonstrated that its MEMS technology achieved all necessary application performance figures-of-merit at record frequencies of 18 MHz in its DC-DC power system-on-chip (PowerSoC). This announcement marks another key milestone in Enpirions leadership and commercialization efforts using low-cost silicon-based magnetics partnering with JCAP with its specialized, high volume wafer level packaging manufacturing capabilities. JCAP is implementing and fully qualifying Enpirions innovative magnetic material processes.

"I am happy to announce our collaboration with JCAP on the integration of Enpirions advanced MEMS technology into JCAPs innovative wafer level manufacturing operations" said Denis Regimbal, CEO of Enpirion. "Since the companys inception, we have invested heavily in developing silicon-based magnetic technologies that complement our high frequency CMOS power technology. This will permit Enpirion to continue to extend its leadership in integrated DC-DC power solutions by penetrating into new applications such as cost-effective LDO replacements."

Lai Chih-Ming, President of JCAP said: "We are excited to have been selected by Enpirion, the leader in integrated power management, to bring to market this advanced technology for magnetic materials on silicon wafers for the first time in power applications using our world renowned, innovative, high volume wafer level bump and chip scale manufacturing processes. Clearly this next generation technology will deliver the first low cost, fully integrated DC-DC converter on silicon. We look forward to growing this business with Enpirion." 

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