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Partnership To Power TD-LTE Mobile Hotspot

Tue, 11/29/2011 - 6:21am

Altair Semiconductor,a leading developer of ultra-low power, small footprint and high performance 4G LTE chipsets, and AsiaTelco Technologies, a leading supplier of wireless terminal products, announced that Altair's chipset has been integrated in AsiaTelco's TD-LTE Mobile Hotspot product, the ALM-F190. The ALM-F190 made its debut at the ITU's (International Telecommunication Union) Telecom World Geneva 2011 Conference, where it was demonstrated by China Mobile.

“AsiaTelco is committed to the commercialization of TD-LTE, as demonstrated by this world-first TD-LTE product announcement,” said Jason Ding, CEO of AsiaTelco. “The selection of Altair’s LTE chipset for this product has enabled us to develop a compact and low power device, while benefitting from the high level of maturity and field testing encompassed in its software.”

ALM-F190 is the first Mobile Hotspot product designed for both TD-LTE and FDD-LTE, capable of delivering 100Mbps downlink and 50Mbps uplink. The product enables users to experience applications such as high-definition video streaming, online gaming and high speed Internet browsing using multiple connected WiFi devices over a single 4G LTE connection. The product features long usage and standby times.

“We are very proud to have our chipset power the world’s first TD-LTE Mobile Hotspot product,” said Eran Eshed, Co-Founder and VP of Marketing and Business Development at Altair Semiconductor. “AsiaTelco's choice of Altair chipsets for this innovative product attests to the low power and high performance merits of the chipset, as well as the maturity of our software. We look forward to partnering with AsiaTelco to introduce new and exciting products in the future.”

AsiaTelco is a leading supplier of 4G products, including LTE USB dongles, wireless data modules and indoor and outdoor CPEs, covering several frequency bands. The China-based manufacturer has shipped products to more than 30 countries around the world.

Altair’s FourGee-3100/6200 is a 3GPP LTE chipset that supports LTE throughputs in excess of 100Mbps/50Mbps DL/UL respectively. The chipset implements a high performance MIMO receiver and is based on a proprietary O²P™ Software Defined Radio (SDR) processor, offering performance which significantly exceeds traditional communications DSP cores, yet consumes a fraction of the power. The FourGee-3100/6200 supports both FDD and TDD variants using single software, and covers any LTE frequency band in the range between 700-2700MHz. The combined chipset offers terminal manufacturers a true global solution.

Altair’s products are among the smallest and most highly power optimized in the industry, offering an unmatched combination of flexibility and performance. For more information, visit the company's website at www.altair-semi.com. Follow Altair on Twitter: @AltairSemi

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