Texas Instruments Inc. (TI) announced that it has shipped more than 30 million units of its PowerStack™ packaging technology, which significantly boosts performance, lowers power and improves chip densities in power management devices.
“Performance requirements for computing applications are increasing in order to enable more content such as broadband mobile video and 4G communications,” said Matt Romig, Analog Packaging at TI. “At the same time, there is a need for telecommunications and computing equipment to take up less space. Through a true revolution from 2D to 3D integration, PowerStack enables TI’s customers to meet these demands.”