Rehm Thermal Systems teams up with Siemens CT to tackle component complexities
Highlighting continued cooperation between Rehm Thermal Systems and Siemens CT, the Berlin Technology Forum is fast becoming an important part of the electronics industry’s event calendar. With roughly 100 participants in attendance, the event which addressed the issue of “New Components – Challenges in Processing QFNs and LEDs” was very well visited in Berlin.
As is the case every year, the morning was dedicated to technical presentations which concerned themselves with all aspects of QFN and LED processing and testing.
At the afternoon presentations were complemented by in-depth workshops which took place in Siemens CT laboratories during the afternoon, enabling attendees to investigate the challenges posed by QFN and LED components in a practical environment.
Reflecting on the success of the event, Rehm Sales Manager, Guido Drobny, commented: “We’re delighted with the high turnout at the Berlin Technology Forum; the growth of this event is evidence of the strong working relationship we have established with the team at Siemens CT. As a leading authority in the field of advanced reflow convection & condensation soldering systems, we know that customers rely on us to help them meet their production challenges. We take this responsibility seriously and don’t just deliver on it through product innovation. We also prioritise education through sharing our technology know-how, which is why we’re committed to nurturing events such as the Berlin Technology Forum. I’m delighted with how positive attendee feedback has been following the event and can guarantee that our team is already looking forward to the next one!”