SPP Process Technology Systems (SPTS), a leading manufacturer of plasma etch, deposition, and thermal processing equipment for the semiconductor industry today announced it has received a follow on purchase order from CEA-Leti for its Sigma® fxPTM Physical Vapor Deposition (PVD) system. The 300mm system will be used for advanced Through-Silicon-Via (TSV) development at Leti’s newly-inaugurated 300mm fab extension in Grenoble, France. This system win comes on the heels of an October 2010 agreement between Leti and SPTS to collaborate on creating next-generation high aspect ratio TSVs. The new Sigma system will join SPTS’ silicon etch and dielectric deposition systems previously selected for this new line.
SPTS wins new 300mm PVD order from CEA-Leti
Sun, 02/13/2011 - 2:38pm