A new thermal material breakthrough from Fujipoly allows
engineers to reduce chip and circuit temperature by as much as 11% without the
need for a heatsink.
The advanced four-ply, peel-n-stick FPDSEM 90 Cooling Patch
offers the fastest and easiest way to radiate heat from an electronic component
to the surrounding environment. The patch is applied like a sticker to the
surface of any “hot spot.” The material can also be custom cut or trimmed to
fit virtually any shape.
The low resistance Cooling Patch provides a thermal
conductivity of 1.5 W/m°K and a thermal emissivity of 0.97. Fujipoly’s FPDSEM
90 is 25-mm thick and can be ordered in sheets, rolls, or kiss-cut rolls depending
on the application.