One highlight was the introduction of the first connectivity modules in groundbreaking SESUB (silicon embedding substrate) integration technology. SESUB allows highly integrated ASIC and controller dies with a large number of fine-pitch I/Os to be embedded directly into the substrate layers. The resulting systems in a package (SIPs) can be implemented with considerably smaller dimensions: their insertion height can be reduced by around 35 percent, e.g. from 1.55 mm to no more than 1.0 mm.
A second highlight was the unveiling of a new NTC thermistor-based temperature sensor for measurements from -40 to +1000 °C that is ideally suited for use in the exhaust manifolds of diesel and gas engines. Precise temperature measurement with long-term stability over a very wide temperature range is a prerequisite for high-performance engine management that boosts efficiency and improves exhaust values. Because of its high sensitivity and good signal-to-noise ratio at temperatures below 500 °C the new NTC sensor
is suited especially for cold start and start-stop applications with rapidly changing temperatures.
You will find the charts and summaries of the presentations at the Technologies & Products Press Conference as well as related press releases