What is Most-Important to the Future of Power? You Can Weigh-in on this at Darnell Power Forum

Wed, 09/01/2010 - 12:20pm

Darnell’s Power Forum (DPF ’10), to be hosted in Chicago September 13-15, will feature a Roundtable Discussion of: What will be the Most Important Driver for the Power Electronics Industry in the Future: Architectures, Topologies, Materials or Applications?" moderated by Alix Paultre, Editor-in-Chief of ECN Magazine. This is a hotly debated question that has no clear answers â?? but representatives from six companies are going to try to clarify the issue, and hopefully get a rousing discussion going at the same time. Alex Lidow, CEO from Efficient Power Conversion; Chris Young, Senior Manager Digital Power Technology from Intersil/Zilker; Mark Buccini, Director from Texas Instruments; Arnold Alderman, Principle from Anagenesis; Jim MacDonald, Director from National Semiconductor; and Bob White, Chief Engineer from Embedded Power Labs will present their views in a Roundtable discussion at Darnell’s Power Forum ’10. One of the strengths of the panel is that the individuals and companies represented have been in the industry for a long time and have seen power supply trends come and go. They have experienced many of the changes first-hand and will evaluate the current power supply landscape in their own inimitable styles. You can Register to participate at:.

Power electronics technologies are undergoing a more rapid evolution today than at any time in the past 30 years, including new system-on-chip packaging solutions. Power-Supply-on-Chip (PwrSoC) is one such trend that Arnold Alderman, working with the Tyndall National Institute, will address in his presentation, "Power Converter Miniaturization Trends – Power Supply in Package (PSiP) and Power Supply on a Chip (PwrSoC)." This is a packaging development that is still in a "pre-commercial" phase, and it addresses the need for close-proximity converters to supply power to next-generation microprocessors, graphics chips, ASICs, DSPs, and other high-performance integrated circuits. What applications are driving these new packaging styles? And will the new packaging be an enabler for as-yet unknown power supply designs?




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