Endicott Interconnect Technologies Wins DoD Contract for Hi-Rel Computing Apps
ENDICOTT, NY,—The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc. (EI) a $50.3 million contract modification to produce card frame assemblies for a high reliability, high performance computing application. In addition, the Company received a $15.8 million contract modification for spares in support of program sustainment.
Since the initial contract was awarded, EI has executed the research, development, and production of highly complex assemblies including HyperBGA® organic semiconductor packaging, multi-chip module assemblies, printed circuit boards, functionally-tested circuit board assemblies and engineering services in support of the program. The contract modifications provide for the close out of these products, including spares, as well as sustainment work on all modules, assemblies, and substrates for the life of the product. This latest installment brings the total award value in excess of $432 million.
“This is the culmination of two years of effort and sustained support for this high performance computing application. We look forward to providing continued support to the DoD and working with them as we enter the next era of computing,” commented Eric Hills, VP Business Development & Programs Office at EI.
EI also announced that the Company has been awarded a $39.5M research & development contract modification by the U.S. Department of Defense for phase 2 development of electronic packaging technologies including printed circuit boards and organic substrates for a next generation super computer application.