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TI Demonstrates their DualCool Packaging Technology at APEC 2010

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Featured In: Newsletters | Passive & Discrete Devices | Power Sources | Trade Shows And Associations | The Power Point

Wednesday, March 3, 2010

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Jeff Sherman of TI demonstrated their latest packaging tech - DualCool, which incorporates extra heat-transfer structures in a power MOSFET to improve performance.

For more information visit TI at www.ti.com.

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