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Embedded Tech Trends update: Three things to know about SMARC

Tue, 01/21/2014 - 8:59am
Chris Warner, Executive Editor

I am attending the Embedded Tech Trends (ETT) conference this week in Phoenix, Arizona. It’s a chance for component, board and system level vendors to present the media with the latest technology, discuss industry trends, and to spend some one-on-one time with each member of the media.

Matthias Huber, Vice President of Marketing and Technologist at ADLINK Technologies, gave a presentation about the Smart Mobility Architecture, or SMARC, as it is usually referred. He began by asking how many people in the room know about SMARC. Only a few hands went up in the crowded room. He provided a good overview that included the driving forces behind its growing use, the module sizes (short: 80 x 50 mm; full: 82 x 80 mm), and the connector characteristics.

Since so many attendees were unfamiliar with SMARC, I asked Matthias during our interview to name three problems SMARC can solve for embedded designers. His answer:

1- It is a fast and low-risk approach to allow ARM and Intel in a low power design.

2- SMARC is a multi-vendor standard. Designers choosing a SMARC-based solution do not have to worry about being boxed in by one vendor.

3- It offers a faster time to market and a lower cost of ownership.

You can learn more about the SMARC architecture here: http://www.sget.org/standards/smarc.html

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