Power electronics technologies are undergoing a more rapid evolution today than at any time in the past 30 years, including new system-on-chip packaging solutions. Power-Supply-on-Chip (PwrSoC) is one such trend that Arnold Alderman, working with the Tyndall National Institute, will address in his presentation, “Power Converter Miniaturization Trends – Power Supply in Package (PSiP) and Power Supply on a Chip (PwrSoC).” This is a packaging development that is still in a “pre-commercial” phase, and it addresses the need for close-proximity converters to supply power to next-generation microprocessors, graphics chips, ASICs, DSPs, and other high-performance integrated circuits. What applications are driving these new packaging styles. And will the new packaging be an enabler for as-yet unknown power supply designs?
This trend is just one of many that will be enthusiastically discussed at DPF ’10. Upcoming columns will highlight others, including:
• Renewable Energy
• What Is Most Important to the Future of Digital Power?
• Thin-film Batteries
• Micro Fuel Cells
Check this column regularly for DPF ’10 news!
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For the complete schedule, visit http://dpf.darnell.com/schedule.php