What technology changed board-level assembly in 2013?

Fri, 10/18/2013 - 2:54pm
Kasey Panetta, Managing Editor

Here at ECN we're always looking for what's going to change the world of electrical design. This month we're focusing on board-level assembly. From adhesives to thermal gap pad management, we want to know what's happening in your lab and on your benches!

We know our readers have varied opinions and valuable experiences – now here’s a great opportunity to showcase them. Send us an answer to the question below and if we think yours is the best, we’ll feature your response in the  December print issue.

Ready to give it a try?

What’s  changes in board-level assembly made the biggest impact in 2013?

 Leave a response in the comments or send an email to by Friday Nov. 1st.


Share this Story

You may login with either your assigned username or your e-mail address.
The password field is case sensitive.