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Military Connectors: A Primer

April 1, 2010 9:28 am | by Keith Teichmann, Worldwide Director of Marketing & Product Management, ITT Interconnect Solutions | Comments

Similar to technology trends in other arenas, reduced size and weight, highly reliable materials, and greater functionality are in the forefront of connector design trends for the military market. Deployed in a variety of modern and “future soldier” applications, such as sophisticated command, control, communications, computer, and intelligence (C41) systems...

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Designing a Wireless Heart Rate Monitor with Remote Data Logging

March 31, 2010 5:59 am | by Archana Yarlagadda, Applications Engineer, Cypress Semiconductor | Comments

Extending the Human-to-Machine Interface (HMI) using wireless communications is a fast developing field. Important improvements in HMI functionality have been made possible by continuing advancements in Machine-to-Machine interfaces in terms of increased baud rate, low power consumption and reach (distance) of communication.

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Pin Fin Heat Sinks: A Sharper Way to Keep Medical Electronics Cool

March 31, 2010 5:42 am | by Barry Dagan, Cool Innovations, www.coolinnovations.com | Comments

Electronic medical systems have become substantially more sophisticated and powerful in recent years. As a result, the majority of these systems contain large arrays of power hungry electronic components that require high-performance heat sinks to prevent them from overheating and being damaged or destroyed.

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Simplify USB Isolation in Medical Applications

March 31, 2010 5:10 am | by Mark Cantrell, Analog Devices, Inc., www.analog.com | Comments

The personal computer (PC), currently the standard information-processing device for office and home use, communicates with most peripherals using the universal serial bus (USB). Standardization, cost, and the availability of software and development tools have made the PC very attractive as a host-processor platform for medical and industrial applications...

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Power Packages Unlock Discrete Semiconductor Performance

March 31, 2010 4:47 am | Comments

An Electronic Engineer builds a system out of components; resistors, ICs, MOSFETs and IGBTs. The Power Electronic Engineer has to go beyond the electrical parameters of components and start looking at thermal resistance and capacity, cooling and parasitic inductance.

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What’s Smart about the Smart Grid?

March 26, 2010 1:39 pm | by Paul L. Schimel PE, Senior FAE, International Rectifier (www.irf.com) | Comments

The statistics vary, but all seem to be in agreement that nearly 30 to 40% of the present load base on the grid is caused by induction motors

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Building It Up-Breaking It Down with iSuppli

March 25, 2010 5:42 am | Comments

Building It Up/Breaking It Down with iSuppli provides a quick look inside the latest products, highlighting some of the components used. Today we take a look inside the Apple iMac Desktop Computer.

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Fighting The Counterfeit Semiconductor Epidemic

March 19, 2010 5:46 am | by George Karalias, Rochester Electronics | Comments

As the semiconductor industry has grown dramatically over the last 30 years, so to has the counterfeiting of semiconductors.

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New high-reliability contact system facilitates automated assembly

March 17, 2010 9:43 am | by Dave Humphreys, Product Manager, Harwin Inc | Comments

There are many applications whose operating environments demand the use of an interconnect system with a high-reliability contact. If equipment is to be used where high shock and vibration or extremes of temperature are experienced, connectors based on a standard contact will not be reliable or rugged enough to guarantee signal integrity.

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Static Power Path Management (SPPM) to Provide an Effective Handheld Battery Charger Solution

March 12, 2010 10:44 am | by Chuck Wong and Haitao Hu, Intersil Corporation | Comments

Handheld electronic devices -- regardless of what they are used for or who manufactures them -- share one common denominator: a re-chargeable battery and, in most cases, a built-in charger circuit. When an external power source such as an AC adapter or a USB port is attached at the input terminal, the charger circuit will re-charge the battery.

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Brainstorm: Photovoltaics

March 11, 2010 8:20 am | by Edited by Jason Lomberg, Technical Editor | Comments

How can we make solar panels more efficient?

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Brainstorm: Batteries

March 11, 2010 4:34 am | by Edited by Jason Lomberg, Technical Editor | Comments

What is the next breakthrough in battery technology?

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Design Tips Save MCU Power

March 11, 2010 4:11 am | by Jon Titus, Senior Technical Editor | Comments

Microcontrollers offer engineers a variety of power-saving techniques. But using them effectively requires careful attention to tradeoffs in software and hardware at the start of a project. "Engineers must partition their application so they have a rough idea how long their microcontroller will stay in a sleep mode or in an active mode," said Mike Salas...

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Get Rolling with Efficient Motor-Control Designs

March 11, 2010 3:58 am | by Jon Titus, Senior Technical Editor | Comments

To find out more about the state of motor-control design in embedded systems, I recently talked with three engineers at Texas Instruments who work with motor-related hardware and software. "Motor control looks simple to start but it covers many disciplines so it's almost impossible to have one designer do everything," noted Miroslav Oljaca...

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Next Generation PoP for Processor and Memory Stacking

March 10, 2010 6:47 am | by Helen Katske, Manager, Engineering Services, Micro-Electronics group, Tessera, Phil Damberg, Vice President, Next Generation Packaging, Micro-Electronics group, Tessera, & KM Bang, Senior Engineer, Package Development, Micro-Electronics group, Tessera | Comments

The continued increase in mobile handset functionality is being enabled by more powerful baseband and applications processor chips, which are more frequently coupled with memory devices using package-on-package (PoP) stacking.

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