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Brainstorm: Optoelectronics

June 3, 2010 7:25 am | by Edited by Jason Lomberg, Technical Editor | Comments

What will be the next big advance in touchscreen technology?

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The High Speed Data Race

June 3, 2010 5:32 am | by James O. “Jim” Farmer, Enablence Systems | Comments

The bottom line is that nothing, and I mean nothing, can beat a fiber connection, not now and not in the foreseeable future. Fiber offers the highest speeds you can achieve, not to mention its other advantages such as extremely low operational costs and versatile high quality transmission.

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A remarkable display: SID 2010

June 2, 2010 12:46 pm | by Jason Lomberg, Technical Editor | Comments

Seattle: home of Microsoft, Starbucks, grunge rock, the Mariners, and in 2010, the Society for Information Display (SID) Conference. This year’s show was a remarkable display (no pun intended) of eye candy and emerging technologies. Among the many developments, 3D, energy efficiency, and advanced touchscreens took center stage.

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Changing times

June 1, 2010 5:12 am | by Alix Paultre, Editor in Chief | Comments

The good news is that the current business in the electronic component and subsystem industry will probably continue to improve, but the bad news is most of the jobs lost in the Great Recession aren’t ever coming back. At recent events such as Embedded Systems and the Electronic Distribution Show, every company I spoke to was doing double-digit business percentages over last year...

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Reverse Dimple Compensates for Tactile Metal Dome Switch Misalignment

June 1, 2010 4:37 am | by Jon Mullett, New Product R&D, Snaptron (www.snaptron.com) | Comments

Smaller tactile domes bring with them manufacturing challenges when it comes to aligning them with the keypad overlays.

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The ECN Roundtable - Mixed-Signal ICs

May 24, 2010 8:05 am | Comments

This month's question, "In what area of development do you feel the most progress in mixed-signal ICs will occur?" was answed by Raymond Lee of MagnaChip, Stephen Kempainen of National Semiconductor, and John Whalen of Fairchild Semiconductor.

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3D IC Development Needs Innovative Socket Solution

May 24, 2010 6:49 am | by Ila Pal, Ironwood Electronics | Comments

Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stacking in one package, package-in-a-package stacking or package on package stacking.

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LED Based Rear Combination Lamps and their Practical Applications

May 24, 2010 5:02 am | by Brian Blackburn, Field Application Engineer, ON Semiconductor | Comments

LEDs have recently garnered favor in the automotive community for their inherent long life as well as styling and design ques. Unlike the single point incandescent bulb, several LEDs acting in conjunction provide the required intensity for the combined Stop and Tail lamp functions.

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Specialty Distributors offer Advantages over Big Box and On-line Outlets

May 21, 2010 12:54 pm | by John Hamilton, Director, Product Marketing, RFMW | Comments

What value does a component distributor offer other than obtaining goods from a single source? Can they offer value beyond that convenience? Large distributors offer everything from resistors to fully programmable gate arrays (FPGAs).

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Distributors Address Counterfeiting, Difficult Economy

May 21, 2010 12:50 pm | by Steve Slawinski, IC Plus | Comments

The electronic component distribution market has gone through many changes over the past decade. Currently, one of the biggest problems is the emergence of counterfeit components, largely stemming from China. Although the Asian marketplace has proliferated in flooding the market with more and less expensive components, domestic profit margins have decreased largely in part to counterfeit product.

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Half-Watt LEDs Fill the Gap Between 0.25 W and 1 W LEDs

May 21, 2010 12:32 pm | by Keat-Chuan Ng and Margaret Tan, Avago Technologies | Comments

Half-Watt (0.5 W) LEDs are gaining more attention from product designers because they fulfill the need for a device that falls between 0.25 W and 1 W LEDs. As more consumer products become smaller and more energy efficient, more designers are selecting 0.5 W LEDs for use in their designs.

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Connectors for Soldier Technology

May 21, 2010 12:12 pm | by Ted Worroll, David Impett, and Barry Cambeilh, ITT Interconnect Solutions | Comments

The “future” dismounted soldier sector is increasingly using advanced technology to equip its infantry, and sophisticated command, control, communications, computer and intelligence (C41) systems are being deployed that require increasingly sophisticated interconnection.

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A Bright Future for High Speed I-O Cable Links

May 21, 2010 11:45 am | by David Sideck, FCI, www.fciconnect.com | Comments

The pull from consumers’ seemingly insatiable appetite for video content - whether clips on sites like YouTube, real-time Internet video, ambient video from security monitoring cameras, or video downloads from service providers for instant entertainment - is expected to continue to be the principal driver of extremely high growth of IP traffic for the foreseeable future.

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Making the connection in harsh environments: MIL and ESA-spec connectors

May 21, 2010 11:32 am | by Gilles Parguey, Senior Product Manager, C&K Components | Comments

United States military and European Space Agency (ESA) specifications are more rigorous than ever, and connectors must be designed in accordance with a number of MIL and ESA qualifications and quality levels. In order to meet these qualifications, and thus be designed into military and aerospace applications...

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Building It Up-Breaking It Down with iSuppli

May 21, 2010 8:23 am | Comments

Building It Up Breaking It Down with iSuppli provides a quick look inside the latest products, highlighting some of the components used. Today we take a look inside the Nokia N900 Mobile Handset.

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