Master Bond EP21FL is a two-part epoxy resin system that features low to moderate viscosity. It is suited for potting, coating and sealing
electronic assemblies and bonds dissimilar substrates with different coefficients of expansion. The adhesive has a wide service
temperature range of -60F to 250F. The typical viscosity of Part A is 4,000 cps at 25C and 10,000 cps at 25C for Part B. This system produces high strength castings, bonds and seals which are resistant to
thermal cycling and shock. Its bond strength is generally greater than 1,500 psi, and its tensile strength normally exceeds 1,100 psi. The hardened compound is an
electrical insulator with a volume resistivity of >10-12 Ohm-cm. As a flexibilized system, it is characterized by desirable impact and chemical resistance.
Master Bond 201-343-8983,
www.masterbond.com
